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We extend the reach of temporal computing schemes by developing a memory for multi-channel temporal patterns or "wavefronts." This temporal memory re-purposes conventional one-transistor-one-resistor (1T1R) memristor crossbars for use in an arrival-time
Ahmad R. Kirmani, Huilang Chen, Christopher Stafford, Emily Bittle, Lee J. Richter
Scalable, solution-deposited metal oxide (MO) thin films could enable low-cost, flexible, large- area electronics; however, the poor morphology of the typically polycrystalline films limits performance. It is demonstrated that optimized coating thickness
Seulki Cho, Son T. Le, Curt A. Richter, Arvind Balijepalli
We demonstrate that single-gated, commercially-sourced, field-effect transistors (FETs) operated with a lock- in amplifier (LIA) under closed-loop control can achieve an average pH resolution of 9x10^-4. This performance represents an 8-fold improvement
Maicol A. Ochoa, James E. Maslar, Herbert S. Bennett
Raman measurements can be utilized as a non-destructive method for determining carrier density in compound semiconductors. Rigorous determination of carrier density involves comparing measured and simulated coupled phonon-plasmon Raman spectra. Theories of
Robin P. Hansen, Amit K. Agrawal, Michael Shur, Jerry Tersoff, Babak Nikoobakht, Yuqin Zong
"Efficiency droop," i.e., a decline in brightness of light-emitting diodes (LEDs) at high electrical currents, limits the performance of all commercial LEDs and has limited the output power of submicrometer LEDs and lasers to nanowatts. We present a fin p
Ana C. de Moraes1, Jan Obrzut, Vinod K. Sangwan, Julia R. Downing, Lindsay E. Chaney, Dinesh K. Patel, Randolph Elmquist, Mark C. Hersam
Solution-processed graphene inks using ethyl cellulose polymer as a binder/stabilizer were blade-coated into large area films. Systematic charge transport characterization showed graphene patterns with high mobility ( 160 cm2 V-1 s-1), low energy gap
Matthew Brubaker, Alexana Roshko, Samuel Berweger, Paul T. Blanchard, Todd E. Harvey, Norman A. Sanford, Kris A. Bertness
Lateral piezoresponse force microscopy (L-PFM) is demonstrated as a reliable method for determining the crystallographic polarity of individual, dispersed GaN nanowires that were functional components in electrical test structures. In contrast to PFM
Semiconductor quantum dot (QD) devices experience a modulation of the band structure at the edge of lithographically defined gates due to mechanical strain. This modulation can play a prominent role in the device behavior at low temperatures, where QD
Pragya R. Shrestha, xiao Lyu, Mengwei Si, Jason P. Campbell, Kin P. Cheung, Peide Ye
The polarization switching speed of ferroelectric (FE) hafnium zirconium oxide (HZO) is studied with the device size down to sub-μm in lateral dimension. Ultrafast measurement of transient switching current on metal-ferroelectric-metal (MFM) device with a
We observed at very low drain bias an anomalous acceleration of Negative-bias-instability at room temperature, as if the channel temperature has been raised significantly. The channel width and channel length dependent of this acceleration suggest that in
Dmitry Veksler, gennadi bersuker, A W. Bushmaker, Maribeth Mason, Pragya Shrestha, Kin P. Cheung, Jason Campbell, T Rueckes, L Clevlend, H Luan, D C. Gilmer
Carbon nanotubes (CNT) resistance-change memory devices were assessed for neuromorphic applications under high frequency use conditions by employing the ultra-short (100 ps -10 ns) voltage pulse technique. Under properly selected operation conditions, CNTs
Ming Chun Tang, Yuanyuan Fan, Dounya Barrit, Ruipeng Li, Hoang X. Dang, Siyuan Zhang, Timothy J. Magnanelli, Nhan V. Nguyen, Edwin J. Heilweil, Christina A. Hacker, Detlet-M Smilgies, Kui Zhao, Aram Amassian, Thomas D. Anthopoulos
Perovskite photovoltaics have made extraordinary progress in efficiency and stability in the past few years owing to process and formulation developments like antisolvent drip and mixed-cation mixed-halide compositions. Perovskite solar cells performance
In this paper, we describe the development, and application, of a suite of high-frequency electromagnetic wave (RF) based techniques to probe material and structural changes in copper interconnects in TSV enabled 3-D integrated circuits during high