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Microwave Monitoring of Atmospheric Corrosion of Interconnects



Papa Amoah, Dmitry Veksler, Christopher E. Sunday, Stephane Moreau, David Bouchu, Yaw S. Obeng


Traditional metrology has been unable to adequately address the reliability needs of emerging integrated circuits at the nano scale; thus, new metrology and techniques are needed. In this paper, we use microwave propagation characteristics (insertion losses and dispersion) to study the atmospheric interconnect corrosion under accelerated stress conditions. The picture that emerges from this work shows that the corrosion resilience of the test device is limited by the thermal aging of the passivation layer.
ECS Journal of Solid State Science and Technology


microwave insertion loss, corrosion, copper oxide, passivation failure


Amoah, P. , Veksler, D. , Sunday, C. , Moreau, S. , Bouchu, D. and Obeng, Y. (2018), Microwave Monitoring of Atmospheric Corrosion of Interconnects, ECS Journal of Solid State Science and Technology, [online],, (Accessed May 21, 2024)


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Created December 27, 2018, Updated October 12, 2021