Published: December 28, 2018
Papa K. Amoah, Dmitry Veksler, Christopher E. Sunday, Stephane Moreau, David Bouchu, Yaw S. Obeng
Traditional metrology has been unable to adequately address the reliability needs of emerging integrated circuits at the nano scale; thus, new metrology and techniques are needed. In this paper, we use microwave propagation characteristics (insertion losses and dispersion) to study the atmospheric interconnect corrosion under accelerated stress conditions. The picture that emerges from this work shows that the corrosion resilience of the test device is limited by the thermal aging of the passivation layer.
Citation: ECS Journal of Solid State Science and Technology
Pub Type: Journals
microwave insertion loss, corrosion, copper oxide, passivation failure
Created December 28, 2018, Updated January 30, 2019