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PUBLICATIONS

Microwave Monitoring of Atmospheric Corrosion of Interconnects

Published

Author(s)

Papa Amoah, Dmitry Veksler, Christopher E. Sunday, Stephane Moreau, David Bouchu, Yaw S. Obeng

Abstract

Traditional metrology has been unable to adequately address the reliability needs of emerging integrated circuits at the nano scale; thus, new metrology and techniques are needed. In this paper, we use microwave propagation characteristics (insertion losses and dispersion) to study the atmospheric interconnect corrosion under accelerated stress conditions. The picture that emerges from this work shows that the corrosion resilience of the test device is limited by the thermal aging of the passivation layer.
Citation
ECS Journal of Solid State Science and Technology
Volume
7
Issue
12
Pub Type
Journals

Download Paper

https://doi.org/10.1149/2.0181812jss
Local Download

Keywords

microwave insertion loss, corrosion, copper oxide, passivation failure
Semiconductors and Metals

Citation

Amoah, P. , Veksler, D. , Sunday, C. , Moreau, S. , Bouchu, D. and Obeng, Y. (2018), Microwave Monitoring of Atmospheric Corrosion of Interconnects, ECS Journal of Solid State Science and Technology, [online], https://doi.org/10.1149/2.0181812jss, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=926585 (Accessed October 16, 2025)

Issues

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Created December 27, 2018, Updated October 12, 2021
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