CHIPS for America Awards

The CHIPS for America award will provide Entegris up to $77 million in total direct funding under the CHIPS and Science Act to support the construction of its state-of-the-art manufacturing center in Colorado Springs. The center is being built in multiple phases: the first to support production of FOUPs — which are currently entirely produced abroad — and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. In addition to the manufacturing center, Entegris is also committed to further expanding their R&D capabilities in the United States by the end of the decade.

Develop a new measurement tool to analyze airborne contaminants and toxic gases inside and outside the fab that lead to semiconductor processing defects and safety infringements. This project will benefits U.S semiconductor fabrication facilities.

Develop a simulation tool for photonic integrated circuits that accounts for manufacturing variations and imperfections. This project will benefit the designers of photonic integrated circuits, who will have faster development times as well as U.S. semiconductor manufacturers and fabrication facilities.

This award supports Absolics Inc. in revolutionizing glass core panel manufacturing by developing cutting-edge capabilities through its Substrate and Materials Advanced Technology (SMART) Packaging Program.

The CHIPS for America award will provide Absolics up to $75 million in total direct funding under the CHIPS and Science Act to support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging.

The CHIPS for America award will provide Micron Boise Idaho up to $1.5 billion in total direct funding under the CHIPS and Science Act to support the development of a high-volume manufacturing (HVM) fab, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips. The fab would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products.

The CHIPS for America investment in SK Hynix of up to $458 million in direct funding under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and research and development (R&D) facility.

The CHIPS for America award will provide Hemlock Semiconductor up to $325 million in total direct funding under the CHIPS and Science Act to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production and purification of hyper-pure semiconductor-grade polysilicon.

Develop a Radio Frequency (RF) channel sounder system to accurately characterize the effects of the wireless environment. This project will benefit microelectronics companies and research institutions focused on communication technologies.

The CHIPS for America award will provide the company with up to $123 million in total direct funding under the CHIPS and Science Act to expand and modernize the company’s manufacturing facility in Bloomington, Minnesota, doubling its U.S. production capacity of sensor and power chips within two years.

The CHIPS for America award will provide GlobaWafers with $20 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon-on-insulator (SOI) wafer-manufacturing facility, critical for advanced semiconductor applications.

The purpose of this award is to establish and operate a Manufacturing USA institute, known as SMART USA, focused on efforts to develop, validate, and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processing.

The CHIPS for America award will provide BAE Systems up to $35.5 million in total direct funding under the CHIPS and Science Act to support a modernization project that will replace aging tools and quadruple the production of chips necessary for critical defense programs, including the $1.7 trillion F-35 fighter jet program.

The CHIPS for America award will provide Intel New Mexico up to $500 million in total direct funding under the CHIPS and Science Act to support the modernization of two existing fabs into an advanced packaging facility to close an important gap in the domestic semiconductor supply chain.

The CHIPS for America award will provide Rocket Lab up to $23.9 million in total direct funding under the CHIPS and Science Act to support the creation of a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites. The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States.