On January 31, 2024, the National Advanced Packaging Manufacturing Program (NAPMP) issued a Notice of Intent to announce a competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors.
The NAPMP will invest $3 billion in programs that include an advanced packaging piloting facility for validating and transitioning new technologies to U.S. manufacturers, workforce training programs to ensure that new processes and tools are capably staffed, and funding for projects.
“Advanced packaging” refers to many chips with diverse functions assembled tightly together on a substrate in two or three dimensions at extremely fine dimensions. This method achieves function, performance, and power savings far greater than can be achieved with conventionally packaged chips on a printed circuit board. Recent advances in artificial intelligence, for example, would not be possible without advanced packaging.
Advanced packaging can be a transformative capability that helps U.S. manufacturers compete globally, but there are many technological challenges to solve. The CHIPS Research and Development Office has established the National Advanced Packaging Manufacturing Program to address these challenges, including:
Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS and Science Act offers a once-in-a-generation opportunity to establish a domestic competitive advanced packaging capability in semiconductor manufacturing.
In addition, the NAPMP will help train semiconductor personnel and students in relevant technologies and feed these developments into domestic manufacturing facilities. The NAPMP will work closely with the National Semiconductor Technology Center, the semiconductor-related Manufacturing USA Institutes, the CHIPS Metrology Program, and U.S. industry and academia to make this vision a reality.
The NAPMP will enable the development of a robust domestic advanced packaging ecosystem by:
The six priority research investment areas of the NAPMP are: