CHIPS R&D Funding Opportunities

President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022. The Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry and strengthen the country’s economic and national security. Of that sum, CHIPS for America within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor research and development (R&D) through four programs:    

• The CHIPS National Semiconductor Technology Center (NSTC) Program
• The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) 
• The CHIPS Metrology Program   
• The CHIPS Manufacturing USA Program

CHIPS for America has released the following Notice of Intent (NOI) for CHIPS R&D Programs:  

July 9, 2024: NOI: CHIPS National Advanced Packaging Manufacturing Program (NAPMP)

• The U.S. Department of Commerce issued an NOI to open a competition for new R&D activities that will establish and accelerate domestic capacity for semiconductor advanced packaging.  
• The CHIPS for America program anticipates up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the NAPMP.  
• Funded activities are expected to be relevant to one or more of five R&D areas:
  • Equipment, tools, processes, and process integration
  • Power delivery and thermal management
  • Connector technology, including photonics and radio frequency (RF)
  • Chiplets ecosystem
  • co-design/electronic design automation (EDA)
• In addition to the R&D areas, the funding opportunity is expected to include opportunities for prototype developments. 
• More information about the NOI will be shared in an upcoming webinar.

CHIPS for America has released the following Notice of Funding Opportunities (NOFO) for CHIPS R&D Programs:  

May 5, 2024: NOFO: CHIPS Manufacturing USA institute

• U.S. Department of Commerce issued a NOFO to seek proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. 

• The CHIPS for America Program anticipates up to approximately $285 million for a first-of-its kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes. 

• Concept papers were due June 20, 2024. Applications received after this deadline will not be reviewed or considered.

• Full application are due September 9, 2024. Full applications will be accepted only from those applicants invited after concept paper evaluation. 

• Dr. Eric Forsythe, director, and Dr. Michael McKittrick, deputy director, CHIPS Manufacturing USA Program, held a briefing on details of the NOFO on May 8, 2024, at 4:00 pm ET. The presentation and recording are posted on the CHIPS.gov webinars and events page.

February 28, 2024: NOFO: CHIPS NAPMP Materials and Substrates Research and Development

• The U.S. Department of Commerce issued a NOFO to seek applications for R&D activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
• The CHIPS for America program anticipates awarding approximately $300 million in amounts up to approximately $100 million over up to 5 years per award. Program awards may be leveraged by voluntary co-investment. 
• On March 1, 2024, CHIPS for America hosted a briefing on details of the NOFO. The presentation can be found here.
• Full proposals were due July 3, 2024.
• Full applications will only be accepted from applicants who were invited to submit a full application after review of their mandatory concept paper.