Guides and Templates: CHIPS Incentives Program – Commercial Fabrication Facilities

Below are guides and templates to accompany the CHIPS Incentives Program – Commercial Fabrication Facilities Notice of Funding Opportunity. These tools are intended to help applicants collect accurate and detailed information that will strengthen their proposals.

• How to Select Application Pipeline Guide (PDF)
• Statement of Interest Instructions (PDF)
• Pre-application and Application Document Checklists (PDF)
• Creating Inclusive Opportunities for Businesses Guide (PDF)

For pre-applications

Pre-applications are optional, but encouraged, so that applicants may engage in dialogue with the CHIPS Program Office. The optional pre-application opens on March 31, 2023 for applicants seeking funds for leading-edge facilities and on May 1, 2023 for applicants seeking funds for current-generation, mature-node, and back-end manufacturing facilities.

• Pre-Application Instructions (PDF)
• Pre-Application Sources and Uses Template (Excel file)
• Pre-Application Example Financial Model White Paper (PDF) - A how-to guide for potential applicants who are preparing to submit a pre-application.
• Pre-Application Example Financial Model (Excel file) - This workbook serves as an example and/or template for completing the “Summary Financials for Each Project” requirement of the pre-application. The model is meant to be an illustrative example and is not a required template.
• Environmental Questionnaire (PDF) - Optional for the pre-application; required for a full application. Responses to the questionnaire will enable the Department to assess the likely level of review under the National Environmental Policy Act (NEPA) early in the process.

for full applications

The Department will begin accepting applications on March 31, 2023 for leading-edge facilities and on June 26, 2023 for current-generation, mature-node, and back-end facilities. The following materials are intended to assist applicants. 

• Full Application Portal and Upload Instructions (PDF)
• Cover Page Instructions (PDF)
• Full Application Sources and Uses Instructions – Front-end and Back-end Facilities (PDF)
• Full Application Sources and Uses Template – Front-end and Back-end Facilities (Excel file)
• Full Application Sources and Uses Instructions – Semiconductor Materials, Semiconductor Equipment, and Wafer Manufacturing Facilities (PDF)
• Full Application Sources and Uses Template  – Semiconductor Materials, Semiconductor Equipment, and Wafer Manufacturing Facilities (Excel file)
• Guiding Principles for Full Application Financial Model (PDF) - A set of guiding principles on financial model structure, level of granularity, metrics, and scenario analysis related to projects included in the application. The paper provides additional detail and direction beyond those outlined in the funding opportunity.
• Environmental Questionnaire (PDF) - Optional for the pre-application; required for a full application. Responses to the questionnaire will enable the Department to assess the likely level of review under the National Environmental Policy Act (NEPA) early in the process.
• Workforce Development Planning Guide (PDF) - This informational guide provides examples of strategies applicants can use to meet the goals outlined in the Notice of Funding Opportunity.
• Creating Inclusive Opportunities for Businesses Guide (PDF) - This informational guide offers guidance on building and submitting a supplier diversity plan to meet the goals outlined in the Notice of Funding Opportunity.
• National Security Guidebook (PDF) - This informational guide provides national security guidance and information for applicants. 
• Automated Standard Application for Payment (ASAP) Enrollment Form (PDF)