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$36 Billion+ in CHIPS for America Funding Announced
President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022 – creating a $52 billion investment to revitalize America’s domestic semiconductor industry and strengthen the country’s economic and national security. CHIPS for America within the U.S. Department of Commerce is responsible for administering $50 billion of the investments in semiconductor incentives and funding for research and development programs. The activities on this page continue the implementation phase of this key part of President Biden’s Investing in America agenda to bring manufacturing jobs back to the United States, strengthen global supply chains, and secure America’s technology leadership in the 21st century.
This award aims to support Arizona State University in developing the next generation of microelectronics packaging through fan-out-wafer-level processing and exploring the commercial vitality of 300mm wafer-level and 600mm panel-level manufacturing.
This award supports Absolics Inc. in revolutionizing glass core panel manufacturing by developing cutting-edge capabilities through its Substrate and Materials Advanced Technology (SMART) Packaging Program.
The award willsupport Applied Materials in developing and scaling a disruptive silicon-core substrate technology for next-generation advances in packaging and 3D heterogeneous integration.
Proposed Award Amount: up to $105 million in proposed funding (split across Chelmsford, MA; Beaverton, OR, and Camas, WA)
CHIPS Organization
CHIPS Program Office
The proposed investment in ADI would support the expansion and modernization of two advanced research & development (R&D) and Radio Frequency (RF) Microwave (MW) systems manufacturing facilities in Chelmsford, Massachusetts.
Proposed Award Amount: up to $105 million in proposed funding (split across Chelmsford, MA, Beaverton, OR, and Camas, WA)
CHIPS Organization
CHIPS Program Office
CHIPS for America’s proposed investment in Washington would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.
The NSTC is operated by Natcast, a purpose-built, non-profit entity. Natcast works in tandem with the CHIPS NSTC Program, which sits within the Department of Commerce. Read more about the historic and long-lasting investments of NSTC, one of the CHIPS for America R&D Programs here.
The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, is expected to be located the Arizona State University (ASU) Research Park in Tempe, Arizona.
The CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility, is expected to operate in Sunnyvale, California. The proposed facility will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.
Proposed Funding by Natcast: an estimated $825 million
The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York. This proposed facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation by providing NSTC members access to technologies, capabilities, and critical resources.
