CHIPS for America Proposed Funding Sites

Proposed Award Amount: up to $50 million in proposed incentives

The proposed CHIPS for America investment will support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

Proposed Award Amount: up to $1.6 billion in proposed incentives (split across Sherman, TX and Lehi, UT projects)

The proposed CHIPS for America investment would support TI’s investment of more than $18 billion through the end of decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah, and is estimated to create over 2,000 manufacturing jobs and thousands of construction jobs over time.

Proposed Award Amount: up to $1.6 billion in proposed incentives (split across Sherman, TX and Lehi, UT projects)

The proposed CHIPS for America investment would support TI’s investment of more than $18 billion through the end of decade to construct three new state-of-the-art facilities, including two in Texas and one in Utah, and is estimated to create over 2,000 manufacturing jobs and thousands of construction jobs over time.

Proposed Award Amount: up to $450 million in proposed incentives

The proposed CHIPS for America investment will support SK's investment of approximately $3.87 billion in West Lafayette, Indiana to build a memory packaging plant for artificial intelligence (AI) and an advanced packaging R&D facility, creating approximately 1,000 new jobs and filling a critical gap in the U.S. semiconductor supply chain.

Proposed Award Amount: up to $400 million in proposed incentives

The proposed CHIPS for America investment will support Amkor’s investment of approximately $2 billion and 2,000 jobs in a greenfield project in Peoria, Arizona, which will provide full end-to-end advanced packaging for the world’s most advanced semiconductors for applications in high-performance computing, artificial intelligence, communications, and automotive, end markets.

Proposed Award Amount: up to $400 million in proposed incentives (split across St. Peters, MO and Sherman, TX projects)

The proposed CHIPS for America investment will build and expand facilities in Sherman, Texas to establish the first 300mm silicon wafer manufacturing facility for advanced chips in the United States.

Proposed Award Amount: up to $400 million in proposed incentives (split across St. Peters, MO and Sherman, TX projects)

The proposed CHIPS for America investment will build and expand facilities in St. Peters, Missouri to establish a new facility to produce 300mm silicon-on-insulator (“SOI”) wafers.

Proposed Award Amount: up to $6.7 million in proposed incentives

The proposed CHIPS investment would support the construction of RVM’s pure play microelectromechanical systems (MEMS) and sensor foundry facility in Palm Bay, Florida, and is estimated to nearly triple RVM’s manufacturing capacity. MEMS are microscale devices that integrate electrical and mechanical components; their integration with semiconductor components across a wide range of applications enables technology advancements and improved performance.

Proposed Award Amount: up to $75 million in proposed incentives

The proposed CHIPS investment would support Entegris’ construction of its state-of-the-art manufacturing center in Colorado Springs. The center is being built in multiple phases: the first to support production of FOUPs — which are currently entirely produced abroad — and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. In addition to the manufacturing center, Entegris is also committed to further expanding their R&D capabilities in the United States by the end of the decade.

Proposed Award Amount: up to $23.9 million in proposed incentives

The proposed CHIPS investment would help create a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites. The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States.

Proposed Award Amount: up to $75 million in proposed incentives

The proposed CHIPS for America investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging.

Proposed Award Amount: up to $120 million in proposed incentives

The proposed CHIPS for America investment will catalyze investment from private and state sources to expand Polar's manufacturing facility and introduce new technology capabilities in Bloomington, Minnesota. The expansion and modernization would enable Polar to double its U.S. production capacity of sensor and power chips within two years.

Proposed Award Amount: up to roughly $6.14 billion in proposed incentives (split across Boise, ID and Clay, NY projects)

The proposed CHIPS for America investment will construct the first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production. Each fab will have 600,000 square feet of cleanrooms, totaling 2.4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields.

Proposed Award Amount: up to roughly $6.14 billion in proposed incentives (split across Boise, ID and Clay, NY projects)

The proposed CHIPS for America investment would develop a high-volume manufacturing (HVM) fab, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips. The fab would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products.

Proposed Award Amount: up to $6.4 billion in proposed incentives (split across Austin, TX and Taylor, TX projects)

The proposed CHIPS for America will expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies.