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Tech-X Corporation
Key Facts
Purpose
Tech-X Corporation will develop a signoff tool for photonic integrated circuits (PICs) that accounts for manufacturing variations and imperfections; such as non-vertical side walls or line edge roughness; expected from the fabrication to enable faster development of photonic integrated circuits.
Activities to be performed
The Tech-X simulation tool XSim will be modified to account for manufacturing variations and imperfections arising from manufactured photonic devices and their metrology data.
Expected Outcomes
The tool will better understand and predict the effects of manufacturing defects on photonics integrated circuits, allowing for reduced cost and faster development times.
Intended Beneficiaries
The designers of photonic integrated circuits, who will have faster development times as well as U.S. Semiconductor manufacturers and fabrication facilities that will become more competitive by better servicing their customers.
Subrecipient Activities
The recipient plans to subaward funds for workflow management for IP, knowledge of foundry practices, and aid in managing the metrology data.
Related Links
Read the full CHIPS for America press release by clicking here.