The U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production of hyper-pure semiconductor-grade polysilicon.
Polysilicon is the foundational material for microprocessors, artificial intelligence chips, memory, and power devices, and is the physical substance that gives chips their semiconductor properties. The Department's investment in HSC will significantly expand U.S. production capacity of hyper-pure semiconductor grade polysilicon, supporting economic and national security. HSC is the only U.S.-owned manufacturer of hyper-pure polysilicon, and one of just five companies in the world producing it at the purity-level needed for leading-edge semiconductor production.
The construction of HSC’s new manufacturing facility is expected to create approximately 180 manufacturing jobs and over 1,000 construction jobs over time.
To recruit, train, and retain the workforce needed for these projects, HSC will implement a robust workforce strategy informed by the Biden-Harris Administration’s Good Jobs Principles. The direct funding award includes up to $5 million in dedicated funds to implement workforce initiatives such as worker recruitment and training.
To advance its manufacturing workforce efforts:
For its construction workforce:
HSC has committed to work collaboratively with community and strategic partners to create new child care seats, expand affordability for their workers, and strengthen the local child care ecosystem.
In connection with the CHIPS award, the Department is requiring HSC to continue its commitment to the following environmental responsibility and worker safety measures in its operations. As is required for all CHIPS projects, the HSC projects will comply with all applicable environmental laws, including the Clean Water Act, Clean Air Act, Endangered Species Protection Act, and the Resource Conservation and Recovery Act.
In connection with the CHIPS award, HSC is making the following environmental commitments:
HSC has also committed to the following worker safety measures:
As stated in the CHIPS Notice of Funding Opportunity for Commercial Fabrication Facilities, CHIPS for America will disburse direct funding to the company for capital expenditures spent on the projects based on the completion of construction, technology, production, and commercial milestones. The CHIPS Program Office will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions.
All CHIPS funding recipients are required to adhere to restrictions pursuant to the CHIPS Act and NOFO regarding stock buybacks and national security guardrails, which limit the sharing of intellectual property. Corning Incorporated, Hemlock’s parent company, retains the ability to engage in stock buybacks, with certain restrictions, consistent with Corning’s agreement with the Department.
Hemlock Semiconductor Project Overview | ||
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Project Summary | Recipient | Hemlock Semiconductor |
Location(s) | Hemlock, Michigan | |
Financial Summary | Program | CHIPS Program Office |
Direct Funding Amount | Up to $325 million | |
Expected Capital Expenditure | $825 million | |
Workforce Summary | Estimated Job Creation | 180 manufacturing jobs Over 1,000 construction jobs over time |
CHIPS Workforce Funding | Up to $5 million |
Project Statistics: Hemlock, Michigan | ||
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Summary | Project Type | Construction of a new manufacturing facility on HSC’s existing campus dedicated to production |
Technologies | Hyper-pure semiconductor-grade polysilicon | |
Project Timeline | Production will begin in 2028 |