The U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production of hyper-pure semiconductor-grade polysilicon.
Polysilicon is the foundational material for microprocessors, artificial intelligence chips, memory, and power devices, and is the physical substance that gives chips their semiconductor properties. The Department's investment in HSC will significantly expand U.S. production capacity of hyper-pure semiconductor grade polysilicon, supporting economic and national security. HSC is the only U.S.-owned manufacturer of hyper-pure polysilicon, and one of just five companies in the world producing it at the purity-level needed for leading-edge semiconductor production.
Hemlock Semiconductor Project Overview | ||
|---|---|---|
Project Summary | Recipient | Hemlock Semiconductor |
| Location(s) | Hemlock, Michigan | |
Financial Summary | Program | CHIPS Program Office |
| Direct Funding Amount | Up to $325 million | |
| Expected Capital Expenditure | $825 million | |
Workforce Summary | Estimated Job Creation | 180 manufacturing jobs Over 1,000 construction jobs over time |
| CHIPS Workforce Funding | Up to $5 million | |
Project Statistics: Hemlock, Michigan | ||
|---|---|---|
Summary | Project Type | Construction of a new manufacturing facility on HSC’s existing campus dedicated to production |
| Technologies | Hyper-pure semiconductor-grade polysilicon | |
| Project Timeline | Production will begin in 2028 | |