The Department of Commerce awarded Absolics, a subsidiary of the Korea-based SKC, up to $75 million in direct funding which supports the construction of a 120,000 square-foot facility in Covington, Georgia, and the development of substrates technology for use in semiconductor advanced packaging. This investment in Absolics commercial facility will support the U.S. semiconductor supply chain by manufacturing a new advanced material.
Absolics glass substrates will be used as an important advanced packaging technology to increase the performance of leading-edge chips for AI, high-performance compute and data centers by reducing power consumption and system complexity. The glass substrates produced by Absolics enable smaller, more densely packed, and shorter length connections resulting in faster and more energy efficient computing. Currently, the advanced packaging substrates market is concentrated in Asia, and, because of this CHIPS investment, U.S.-based companies would have an expanded domestic supply of glass substrates for advanced packaging.
Advanced packaging is an essential component for U.S. companies to improve semiconductor applications. The path to advanced packaging starts with substrates, which are the foundations on which systems are built. More capable substrates open the door to innovation at every other level in the packaging process.
Absolics Project Overview | ||
|---|---|---|
Project Summary | Recipient | Absolics |
| Location(s) | Covington, Georgia | |
| Congressional District | Georgia's 10th Congressional District | |
Financial Summary | Program | CHIPS Program Office |
| Direct Funding Amount | Up to $75 million | |
| Expected Capital Expenditure | $343 million | |
Facility Summary | Project Type | Construction and technology development |
| Technology | Glass substrates to support advanced packaging | |
| Project Timeline | First deliveries to customers are expected in 2025 and production capacity is expected to kick in 2027 | |