SK hynix (Indiana)

Credit: CHIPS for America

On August 6, 2024, the Biden-Harris Administration announced that the U.S. Department of Commerce and SK Hynix (SK) have signed a non-binding preliminary memorandum of terms to provide up to $450 million in proposed federal incentives under the CHIPS and Science Act to establish high-bandwidth-memory advanced packaging fabrication and research and development (R&D) facility. 

• The proposed CHIPS investment would support SK’s West Lafayette facility at the Purdue University Research Park, which will be home to an advanced semiconductor packaging line that will mass-produce next generation HBM, the highest performance memory chips, that are crucial components of Graphics Processing Units (GPUs) that train AI systems.
• Mass production at the facility is expected to begin in the second half of 2028.
• SK hynix will collaborate with Purdue University on plans for future R&D projects, which include working on advanced packaging and heterogenous integration with Purdue’s Birck Nanotechnology Center and other research and institutes and industry partners.
• The next generation HBM that will be researched and developed, and mass-produced, and packaged in this ecosystem with Purdue University will play an important role in the U.S. semiconductor ecosystem and advancing U.S. technological leadership.