Projects/Programs

Displaying 1 - 16 of 16

Advancing PEEM-based Metrology

Ongoing

Specialized imaging methods with high spatial resolution are essential for advancing the physical understanding of emergent materials in advanced electronics

Advancing Power Electronics with Defect Metrology

Ongoing

The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is

$Contrast enhancement at the diffraction limit using DUV Fourier ptychography (left) and 3D reconstructed image (right).$

DUV/EUV Nanoscopy for Imaging Nanostructures

Ongoing

The project aims to develop the metrology for accurate, reliable characterization of nanostructures using the deep ultraviolet (DUV) and extreme ultraviolet

Massively parallel wafer-level long-term reliability test system featuring 30 fully functioning mini probe stations each supporting 100 probe pins with all the supporting stress/measure electronics integrated (without cables).

Electrical Characterization of Nanoscale Electron Devices

Ongoing

The information economy – the modern economy that heavily dependent on information gathering, transmitting, processing, storing, utilizing and consuming is

Electric Field Gradient reference prototype

Electrical Scanning Probe Microscopy

Ongoing

Develop and apply advanced measurement methods, electric field reference materials, and COMSOL models to make electrical scanning probe microscopes (eSPMs)

Electron Microscopy of Carbon Nanotube Composites

Ongoing

Carbon nanomaterials such as carbon nanotubes (CNTs) and graphene have an extraordinary combination of mechanical, electronic and thermal properties that make

Electronic and Chemical Properties of Systems for Advancing Solid State Quantum-based Devices

Ongoing

The electronic properties of a material govern how they will be used in device form. We apply electron-based analytical methods to image the electronic

EUV Scatterometry

Ongoing

The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning

Schematic diagram of a 3D stacked integrated circuit (3D-SIC), achieved using copper through-silicon via interconnects.

Metrology for Emerging Integrated Systems

Ongoing

This program aims to develop the metrology to enable quantitative assessment of performance limiting reliability issues, and to describe the physics of failure

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

Advanced bonding and integration physically bring together components, devices, and materials that are produced separately. There are strong economic and

Metrology for Printing and Graphic Arts Substrates

Ongoing

This program aims to develop the metrology to enable quantitative understanding of, and the development of standards, in quality and reliability controls in

EDMR set up to measure the electrode process of an electrochemical cell.

Operando Measurements of Electrochemical (Charge-transfer) Processes

Ongoing

Electrochemical processes are ubiquitous. Man-made processes such as energy production by solar cells and battery charging and discharging are examples of

Optical Methods for 3-D Nanostructure Metrology (Archived)

Ongoing

We develop new approaches to optical microscopy and electromagnetic modeling to enable improved metrology of nanoscale structures with dimensions more than an

Schematic of quantum entangled molecules or nanoparticles in dual cavity system.

Photonic Quantum State Imaging Metrology

Ongoing

The project aims to develop the quantum coherence metrology based on single photon state imaging techniques that will elucidate the quantum coherence of single

Schematic of unresolved imaging of a periodic structure. Extracting deep-subwavelength information from such images requires mastery of several techniques; this project seeks to integrate machine learning for metrology.

Quantitative Nanoscale Imaging Through Artificial Intelligence

Ongoing

Key industrial optics-based measurements of nanoscale structures are growing ever-more complex due to increasing device and materials complexity. To meet these

Time-resolved Emission Microscopy for Circuit Evaluation and Failure Analysis

Ongoing

Time-resolved-emission microscopy (TREM) is a workhorse of semiconductor circuit evaluation. However, as transistor dimensions and power-supply voltages have

Advanced communications
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Buildings and Construction
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Chemistry
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Electronics
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Energy
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Forensic Science
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Health
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Infrastructure
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Nanotechnology
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