NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process
The Tousimis Supercritical Automegasamdri-916B Series C critical point dryer uses liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The
The Kulicke and Soffa Model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. The
The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 1 mm thick and supports sizes
The Tresky T-3000-FC3-HF flip chip bonder can dispense solder pastes and epoxies, place solder preforms, and bond various types of devices onto semiconductor
The Allied High Tech Dual Prep PH-3 grinding and polishing system is used to mechanically thin samples and polish cleaved facets in preparation for high
The Lattice Gear LatticeAx cleaving tool is used for highly accurate, manual cleaving of substrates. The system is an indenting and cleaving tool that produces
The Fischione Model 1040 NanoMill is a low-energy, low-angle argon ion milling instrument used for preparing ultra-thin, high-quality transmission electron
White House Office of Science and Technology Policy Blog Post by Colleen V. Chien, senior advisor to the Chief Technology Officer, Intellectual Property and
Secretary of Commerce Penny Pritzker recently reappointed Rulon Stacey as chair of the Baldrige Program's Board of Overseers. She also appointed three new
While national security efforts seek to prevent terrorist attacks, the United States and partner countries should also prepare to work together to mitigate the
Officials at the National Institute of Standards and Technology (NIST) have announced plans to establish two new research Centers of Excellence to work with
Materials Resource Registry allows for the registration of materials resources, bridging the gap between existing resources, software and repositories and end
Blog by Chris Greer, Senior Executive for Cyber-Physical Systems at the National Institute of Standards and Technology In the early 1990s, a Web page consisted
Particles of soot floating through the air and comets hurtling through space have at least one thing in common: 0.36. That, reports a research group at the
Two researchers at the National Institute of Standards and Technology (NIST) are among 12 federal employees being honored today* as recipients of the 2013
The Specialty Coating Systems PDS 2010 parylene deposition system provides users with reliable and repeatable conformal parylene coatings ranging from 75
The Metal Additive Manufacturing (AM) Research Facility is now called the Additive Manufacturing Research Center (AMRC). Additive manufacturing gives U.S
NIST with US Forest Service (USFS) have invested in the development of instrument packages and measurement science to enable the successful scientific use of
In the late 1970s and early 1980s the fire community was pushing for reliable bench-scale tools to measure material flammability based on heat release rate. A
The Plasma-Therm Versaline high density plasma enhanced chemical vapor deposition (HD-PECVD) system uses an inductively coupled plasma to remotely ionize
The Oxford FlexAL atomic layer deposition (ALD) system supports plasma and thermal ALD coating processes with precise ultrathin and pinhole free films. The
The Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
The Denton Vacuum Discovery 550 sputtering system has two direct current (DC) and two radio frequency (RF) sputtering guns which bombard targets, causing atoms
The Denton Vacuum Infinity 22 electron beam evaporator vapor deposits thin films and is capable of loading up to six source materials for deposition. The
The Denton Vacuum Infinity 22 dual source evaporator uses a choice of either electron beam evaporation or resistive heating to vapor deposit thin films