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Gaithersburg

New York Area Disaster Resilience Workshop Set for July 30, 2014

July 1, 2014

The second in a series of regional workshops devoted to developing a community-centric "disaster resilience framework" to minimize the impacts of hazards and

Call for Comments: A Strategic Plan for the Materials Genome Initiative

June 27, 2014

The federal government is looking for public comment on a draft strategic plan for the Obama administration's Materials Genome Initiative (MGI). The draft 2014

NIST to Award up to $2.5 Million for Business-to-Business Matching Systems

June 27, 2014

Through 25 years of working with small and mid-size U.S. manufacturers, the National Institute of Standards and Technology (NIST) Hollings Manufacturing

NIST engineer pointing at a firing pin impression.

NIST Names Members to First Forensic Science Standards Board

June 26, 2014

As part of its efforts to improve the scientific basis of forensic evidence used in courts of law, the U.S. Commerce Department's National Institute of

Legal Task Group

The FSSB’s Legal Task Group is primarily comprised of at least one member from each Scientific Area Committee (SAC) and members from OSAC...

New Math Technique Improves Atomic Property Predictions to Historic Accuracy

June 25, 2014

[This article was revised on July 23, 2014, to clarify the relationship between the work reported here and the related problem of calculating relativistic and

NIST Seeks Members for Three New Cloud Computing Working Groups

June 23, 2014

The National Institute of Standards and Technology (NIST) Cloud Computing Program (NCCP) is forming three public working groups to provide solutions to cloud

Photograph of the Xactix Xetch xenon difluoride silicon etcher.

NanoFab Tool: Xactix Xetch Xenon Difluoride Silicon Etcher

The Xactix Xetch is a single wafer tool which isotropically etches silicon using vapor phase xenon difluoride. The xenon difluoride etch process provides high

Photograph of the SPTS Etch hydrofluoric acid vapor etcher

NanoFab Tool: SPTS microEtch Hydrofluoric Acid Vapor Etcher

The SPTS µEtch is a single wafer hydrofluoric acid vapor etcher used to release silicon microstructures in microelectromechanical systems (MEMS) devices. It

Photograph of the Unaxis 790 reactive ion etcher.

NanoFab Tool: Reactive Ion Etcher Unaxis 790 Right

The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch

NanoFab Tool: Reactive Ion Etcher Unaxis 790 Middle

The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch

Photograph of the 4Wave IBE-20B ion milling system.

NanoFab Tool: 4Wave IBE-20B Ion Milling System

The 4Wave IBE-20B ion milling system uses a broad argon ion beam to controllably and uniformly remove material from a user's substrate. A secondary ion mass

Photograph of the Tousimis Autosamdri-815 Series B critical point dryer.

NanoFab Tool: Tousimis Autosamdri-815 Series B

The Tousimis Supercritical Autosamdri-815 Series B critical point dryer utilizes liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in order

Photograph of the Semitool PSC-101 double stack spin rinse dryer.

NanoFab Tool: Semitool PSC-101 Spin Rinse Dryer

The Semitool PSC-101 spin rinse dryer uses deionized water to rinse and heated nitrogen to dry whole wafer substrates automatically after wet chemical processes

Photograph of the Reynolds RCA wet bench.

NanoFab Tool: Reynolds RCA Wet Bench

The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces

Photograph of the Reynolds Tech silicon nitride etch wet bench.

NanoFab Tool: Reynolds Tech Silicon Nitride Etch Wet Bench

The Reynolds Tech silicon nitride etch wet bench uses dilute phosphoric acid to preferentially etch silicon nitride on silicon. The process is used to define

Photograph of the Reynolds Tech silicon etch wet bench.

NanoFab Tool: Reynolds Tech Silicon Etch Wet Bench

The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process

Photograph of the Tousimis Automegasamdri-916B Series C critical point dryer.

NanoFab Tool: Tousimis Automegasamdri-916B Series C

The Tousimis Supercritical Automegasamdri-916B Series C critical point dryer uses liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in

NanoFab Tool: RCA Wet Bench B102

The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The

Photograph of the Kulicke and Soffa Model 4526 wedge wire bonder.

NanoFab Tool: Kulicke and Soffa Model 4526 Wedge Wire Bonder

The Kulicke and Soffa Model 4526 wedge wire bonder provides electrical interconnects between a device chip and package using thin aluminum or gold wires. The

NanoFab Tool: ADT 7132 Dicing Saw

The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 1 mm thick and supports sizes

Photograph of the Tresky T-3000-FC3-HF flip chip bonder.

NanoFab Tool: Tresky T-3000-FC3-HF Flip Chip Bonder

The Tresky T-3000-FC3-HF flip chip bonder can dispense solder pastes and epoxies, place solder preforms, and bond various types of devices onto semiconductor

Photograph of the Allied High Tech Dual Prep PH-3 grinding and polishing system.

NanoFab Tool: Allied High Tech Dual Prep PH-3 Grinding and Polishing System

The Allied High Tech Dual Prep PH-3 grinding and polishing system is used to mechanically thin samples and polish cleaved facets in preparation for high

Photograph of the Lattice Gear LatticeAx cleave tool.

NanoFab Tool: Lattice Gear LatticeAx Cleaving Tool

The Lattice Gear LatticeAx cleaving tool is used for highly accurate, manual cleaving of substrates. The system is an indenting and cleaving tool that produces

Photograph of the Fischione Model 1040 NanoMill.

NanoFab Tool: Fischione Model 1040 NanoMill Ion Mill

The Fischione Model 1040 NanoMill is a low-energy, low-angle argon ion milling instrument used for preparing ultra-thin, high-quality transmission electron

NIST Cyber-Physical Systems Public Working Group Kickoff Webinar

Mon, Jun 30 2014

What are Cyber-Physical Systems or CPS? Is a CPS any engineered system with a microprocessor? Do all CPS need to be

Accelerating Green Technology Transfer to Impact American Lives

June 17, 2014

White House Office of Science and Technology Policy Blog Post by Colleen V. Chien, senior advisor to the Chief Technology Officer, Intellectual Property and

New Members Appointed to Baldrige Advisory Board

June 16, 2014

Secretary of Commerce Penny Pritzker recently reappointed Rulon Stacey as chair of the Baldrige Program's Board of Overseers. She also appointed three new

New Report Addresses International Disaster Resilience for U.S. and Partner Countries

June 17, 2014

While national security efforts seek to prevent terrorist attacks, the United States and partner countries should also prepare to work together to mitigate the

NIST to Establish New Centers of Excellence for Work in Forensics, Disaster Resilience

June 13, 2014

Officials at the National Institute of Standards and Technology (NIST) have announced plans to establish two new research Centers of Excellence to work with

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