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NanoFab Tool: Tresky T-3000-FC3-HF Flip Chip Bonder

Photograph of the Tresky T-3000-FC3-HF flip chip bonder.

The Tresky T-3000-FC3-HF flip chip bonder can dispense solder pastes and epoxies, place solder preforms, and bond various types of devices onto semiconductor packages, submounts, and whole wafers. The system is equipped with a camera-based vision system to precisely align the parts that will be bonded together.

Specifications/Capabilities

  • Eutectic bonding.
  • Ultrasonic bonding.
  • Thermo-compression bonding.
  • Epoxy bonding.
  • X and Y motion range: 200 mm.
  • Die positioning accuracy: 1 µm.
  • Die spindle rotation range: 2p (360 °).
  • Side-view camera for direct observation of bonding process.
  • Bond force: 50 grams to 400 grams.
  • Tool heat up to 400 °C.
  • Substrate heat up to 400 °C.
  • Inert gas blanket.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.
  • Maximum thickness: 40 mm.

Typical Applications

  • Chip attachment to semiconductor, opto-electronic, microwave, and other packages.
Created June 19, 2014, Updated December 4, 2019