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NanoFab Tool: RCA Wet Bench B102

Photograph of the Reynolds RCA wet bench

The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The bench contains temperature controlled processing baths and a quick dump rinser. In addition, the bench has a dedicated buffered oxide etch bath for patterning silicon oxide. All baths can accommodate substrates ranging from 150 mm diameter wafers down to small pieces

Specifications/Capabilities

  • Tank 1: Buffered oxide etch (BOE) dip tank (5:1 BOE).
  • Tank 2: Reflux heated bath for RCA Standard Clean 1-SC1.
  • Tank 3: Hydrofluoric acid (HF) dip tank with lid (2 % HF).
  • Tank 4: Automatic quick dump rinse with lid.
  • Tank 5: Reflux heated bath for RCA Standard Clean 2-SC2.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.

Typical Applications

  • Pre-furnace clean.
  • Silicon oxide patterning.
Created June 19, 2014, Updated December 4, 2019