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NanoFab Tool: ADT 7132 Dicing Saw

Dicing Saw

ADT 7132 Dicing Saw

The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes ranging from small pieces to 300 mm diameter wafers.


  • Automatic mode for full wafer dicing.
  • Measurement resolution: 0.1 µm.
  • Positioning accuracy: 0.5 µm.
  • Typical blade thickness (width of cut): 35 µm (45 µm) to 200 µm (240 µm)

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 300 mm (12 in).
  • Small pieces supported: Yes.
  • Maximum thickness: 4 mm.

Typical Applications

  • Device separation after wafer processing.
  • Dicing of silicon, glass, Pyrex, quartz, sapphire, lithium niobate and silicon carbide.
Created June 19, 2014, Updated August 25, 2023