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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
Time-resolved-emission microscopy (TREM) is a workhorse of semiconductor circuit evaluation. However, as transistor dimensions and power-supply voltages have
The Metal Additive Manufacturing Powder (MAMP) Consortium brings together stakeholders to develop deeper understanding of additive manufacturing (AM) metal
The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high
NIST delivered the first NIST Standard Reference Instrument (SRI) to Spain’s oldest calibration laboratory, the National Institute of Aerospace Technology
As the transition from fifth-generation wireless systems (5G) to next-generation communications systems (NextG) advances, research and development (R&D)
Microscopic magnetic probes that change shape in response to their environment may greatly enhance magnetic resonance imaging (MRI). However, producing the
NIST released an updated version of its Interagency Report on Advanced Communication Technologies Standards which is a guide for Federal agencies on standards
Researchers at NIST and their colleagues have built a superconducting camera containing 400,000 pixels — 400 times more than any other device of its type.