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The Sensor Readout Project within the Quantum Electronics Group leverages the sensitivity of superconducting quantum interference devices (SQUIDs), low-noise
On January 29, 2024, representatives of NIST and the Republic of Korea's government metrology agency – the Korea Research Institute of Standards and Science
Perched atop a high plateau in Chile’s Atacama Desert, a long-awaited observatory is beginning to take shape: the largest suite of ground-based telescopes
Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
Time-resolved-emission microscopy (TREM) is a workhorse of semiconductor circuit evaluation. However, as transistor dimensions and power-supply voltages have
The Metal Additive Manufacturing Powder (MAMP) Consortium brings together stakeholders to develop deeper understanding of additive manufacturing (AM) metal
The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high
NIST delivered the first NIST Standard Reference Instrument (SRI) to Spain’s oldest calibration laboratory, the National Institute of Aerospace Technology
As the transition from fifth-generation wireless systems (5G) to next-generation communications systems (NextG) advances, research and development (R&D)
Microscopic magnetic probes that change shape in response to their environment may greatly enhance magnetic resonance imaging (MRI). However, producing the