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Summer High School Internships with the Communications Technology Laboratory

Internships with the Communications Technology Laboratory

The 2024 Summer High School Internship Program (SHIP) program for CTL is designed to provide an unpaid 8-week hands-on educational research experience in communications technology. CTL's SHIP projects offer in-person opportunities in Boulder, Colorado. Applications are due February 9, 2024.  

With expertise honed over decades of research in antennas and wireless propagation, materials science and electronics testing, as well as communications network protocols and standards, CTL serves as an independent, unbiased arbiter of trusted measurements and standards to government and industry. We focus on developing precision instrumentation and creating test protocols, models, and simulation tools to enable a range of emerging wireless technologies. Click here for additional information on CTL.  

QUESTIONS?    If you have any questions about these opportunities, or about the application process, please e-mail  Chris Carson at Christine.carson [at] (Christine[dot]carson[at]nist[dot]gov)


Opportunities in Boulder, CO:   

RF Technology Division

Quantum Networking and Transduction Project

Networking superconducting quantum computers will allow them to scale and reach unprecedented capacity far beyond classical computers. We are creating remote microwave entanglement with optical two-mode squeezed states and microwave-optical quantum transducers. This SHIP opportunity involves enhancing laser-cavity locking techniques, programming feedback control systems, and measuring quantum optical and microwave states.

Waveform Project

The calibration of high-speed oscilloscopes and pulse generators is achieved using high-frequency circuitry that acquires a phased-lock loop with the measurement equipment. To calibrate pulse generators a millimeter wave integrated circuit is used to create a sharp rise time in the trigger signal. This opportunity would be to design a circuit, have a PCB fabricated, and assemble the IC and circuit components into a connectorized package. Finally, we will test the electrical performance of the circuit. The student will gain experience with circuit design, PCB layout software, soldering components, and using electrical test equipment.


Created January 29, 2024, Updated January 30, 2024