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Displaying 7501 - 7525 of 13218

Comparison of the Identities, Fluxes, and Energies of Ions Formed in High Density Fluorocarbon Discharges

January 1, 2001
Author(s)
Amanda N. Goyettes, Yicheng Wang, James K. Olthoff
… Positive ion bombardment plays an essential role in plasma processing, influencing etch rates, materials … Experimental determination of ion identities and energies in processing plasmas provides complementary data necessary … summary of ion compositions and energy distributions in inductively coupled discharges sustained in six …

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
… The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various … recrystallization at room temperature that results in a 23% drop in resistivity within a few hours of deposition. … Conference on Characterization and Metrology for ULSI Technology

Dopant Characterization Round-Robin Study Performed on Two-Dimensional Test Structures Fabricated at Texas Instruments

December 31, 1998
Author(s)
J. Vahakangas, Markku Lahti, M C. Chang, H Edward, C F. Machala, R S. Martin, V Zavyalov, J S. McMurray, C. C. Williams, P DeWolf, Vandevorst, D. Venables, S S. Neogi, D L. Ottaviani, Joseph Kopanski, J F. Machiando, Brian G. Rennex, J N. Nxulamo, Y Li, D J. Thomson
… or theoretical effort to characterize silicon doping in two dimensions. Recently, a strong progress has been made in quantitative scanning capacitance microscopy (SCM), … advanced SCM, SSRM, and TEM dopant profiling, participated in the study. Related process information and ID dopant …

Thin Film Ellipsometry Metrology

December 31, 1998
Author(s)
P. Durgapal, James R. Ehrstein, Nhan Van Nguyen
… Conference on Characterization and Metrology for ULSI Technology

High-Resolution, High-Accuracy, Mid-IR (450 cm -1 less than or equal to} o less than or equal to} 4000 cm -1 ) Refractive Index Measurements in Silicon

March 1, 1998
Author(s)
Deane Chandler-Horowitz, Paul M. Amirtharaj, John R. Stoup
… this procedure is dependent upon the measurement error in the sample thickness, the absolute transmission values obtained from a sample-in and sample-out method, and the modeling of the influence … Conference on Characterization and Metrology for ULSI Technology

The Effect of End of Range Loops on Transient Enhanced Diffusion in Si

April 1, 1997
Author(s)
K. S. Jones, K. Moller, M. Puga-Lambers, M. Law, David S. Simons, P Chi, B. Freer, J. Bernstein, L. Rubin, R. Simonton, R. G. Elliman, M. Petravic, P. S. Kringhoj
… of the 11th International Conference Ion Implantation Technology … of End of Range Loops on Transient Enhanced Diffusion in Si …

Defect Formation Mechanisms in Low Dose SIMOX Material

December 31, 1996
Author(s)
S. Bagchi, J. H. Lee, S. J. Krause, Peter Roitman
… Electrochemical Society International Symposium on SOI Technology and Devices … Defect Formation Mechanisms in Low Dose SIMOX Material …

D4I-Digital forensics framework for reviewing and investigating cyber attacks

December 26, 2019
Author(s)
Athanasios Dimitriadis, Boonserm Kulvatunyou, Nenad Ivezic, Ioannis Mavridis
… is prior knowledge about software and mechanisms used in the cyber-attack, i.e., they are not attack-agnostic. … not suffering from such issue, lack the ability to provide in-depth support to a cyber-attack investigation. The reason being that there are insufficient details in the examination and analysis phases of the processes where …

Programming Interfacial Porosity and Symmetry with Escherized Colloids

February 22, 2024
Author(s)
Nathan Mahynski, Vincent K. Shen
We simultaneously design the porosity and plane symmetry of self-assembling colloidal films by using isohedral tiles to determine the location and shape of enthalpically interacting surface patches on motifs being functionalized. The symmetries of both the
Displaying 7501 - 7525 of 13218
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