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Cu Electrodeposition for On-Chip Interconnections

Published

Author(s)

Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky

Abstract

The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the electrolytes reveal a hysteretic response associated with the C1-PEG-MPSA system that can usefully employed to monitor and explore additive efficacy and consumption. Likewise, resistivity measurements performed on corresponding blanket films can be used to quantify the extent of additive incorporation and its influence on microstructural evolution. The films deposited from the C1-PEG-MPSA electrolyte exhibit spontaneous recrystallization at room temperature that results in a 23% drop in resistivity within a few hours of deposition.
Proceedings Title
Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology
Volume
550
Issue
No. 1
Conference Dates
June 26-29, 2000
Conference Title
AIP Conference Proceedings

Keywords

additives, adsorption, copper, hysteresis, metallization, recrystallization, resistivity

Citation

Stafford, G. , Moffat, T. , Jovic, V. , Kelley, D. , Bonevich, J. , Josell, D. , Vaudin, M. , Armstrong, N. , Huber, W. and Stanishevsky, A. (2001), Cu Electrodeposition for On-Chip Interconnections, Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology (Accessed February 25, 2024)
Created January 1, 2001, Updated February 17, 2017