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Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
Abstract
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the electrolytes reveal a hysteretic response associated with the C1-PEG-MPSA system that can usefully employed to monitor and explore additive efficacy and consumption. Likewise, resistivity measurements performed on corresponding blanket films can be used to quantify the extent of additive incorporation and its influence on microstructural evolution. The films deposited from the C1-PEG-MPSA electrolyte exhibit spontaneous recrystallization at room temperature that results in a 23% drop in resistivity within a few hours of deposition.
Proceedings Title
Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology
Stafford, G.
, Moffat, T.
, Jovic, V.
, Kelley, D.
, Bonevich, J.
, Josell, D.
, Vaudin, M.
, Armstrong, N.
, Huber, W.
and Stanishevsky, A.
(2001),
Cu Electrodeposition for On-Chip Interconnections, Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology
(Accessed October 10, 2025)