Cu Electrodeposition for On-Chip Interconnections

Published

January 1, 2001

Author(s)

Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky

Abstract

The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the electrolytes reveal a hysteretic response associated with the C1-PEG-MPSA system that can usefully employed to monitor and explore additive efficacy and consumption. Likewise, resistivity measurements performed on corresponding blanket films can be used to quantify the extent of additive incorporation and its influence on microstructural evolution. The films deposited from the C1-PEG-MPSA electrolyte exhibit spontaneous recrystallization at room temperature that results in a 23% drop in resistivity within a few hours of deposition.

Proceedings Title

Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology

Volume

550

Issue

No. 1

Conference Dates

June 26-29, 2000

Conference Title

AIP Conference Proceedings

Pub Type

Conferences

Keywords

additives, adsorption, copper, hysteresis, metallization, recrystallization, resistivity

Citation

Stafford, G. , Moffat, T. , Jovic, V. , Kelley, D. , Bonevich, J. , Josell, D. , Vaudin, M. , Armstrong, N. , Huber, W. and Stanishevsky, A. (2001), Cu Electrodeposition for On-Chip Interconnections, Proceedings of the 2000 International Conference on Characterization and Metrology for ULSI Technology (Accessed October 15, 2025)