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Displaying 626 - 650 of 1446

Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses

May 12, 2014

Author(s)

Lin You, Chukwudi A. Okoro, Jungjoon Ahn, Joseph Kopanski, Yaw S. Obeng

In this paper we describe the development of a suite of techniques, based on the application of high frequency electromagnetic waves, to probe material and structural changes in integrated circuits under various external perturbations. We discuss how these

Scanning Probe Microscopes for Subsurface Imaging

May 11, 2014

Author(s)

Joseph J. Kopanski, Lin You, Jungjoon Ahn, Emily Hitz, Yaw S. Obeng

Scanning probe microscopes (SPMs) have some ability to image sub-surface structures. This paper describes the theoretical and practical basis for imaging metal lines buried beneath insulating layers and for imaging insulating regions or voids within metal

Time-domain stabilization of carrier-envelope phase in femtosecond light pulses

May 7, 2014

Author(s)

Young-Jin Kim, Ian R. Coddington, William C. Swann, Nathan R. Newbury, Joohyung Lee, Seungchul Kim, Seung-Woo Kim

We report a time-domain method of stabilizing the carrier-envelope phase (CEP) of femtosecond pulses. Temporal variations of the pulse envelope and the carrier electric-field phase were separately detected with the aid of intensity cross-correlation and

Accurate RRAM Transient Currents during Forming

April 30, 2014

Author(s)

Pragya R. Shrestha, David M. Nminibapiel, Jason P. Campbell, Jihong Kim, Canute I. Vaz, Kin P. Cheung, Helmut Baumgart

Current overshoot during forming has been shown to be a serious issue. Recently the current overshoot duration has been shown to be an important factor impacting device performance. Short duration overshoot in the range of ns yield better performance. But

Roles of Nanofiber Structure and Chemistry in Directing Stem Cell Morphology, Differentiation and Gene Expression

April 19, 2014

Author(s)

Sumona Sarkar, Bryan A. Baker, Desu Chen, Wolfgang Losert, Carl G. Simon Jr., Joy P. Dunkers

Nanofiber technology has emerged as a promising tool to recapitulate the native extracellular matrix (ECM) environment for tissue engineering and regenerative medicine strategies. Cell-material interactions in the nanofiber system are largely dependent on

Optimizing Hybrid Metrology through a Consistent Multi-Tool Parameter Set and Uncertainty Model

April 14, 2014

Author(s)

Richard M. Silver, Bryan Barnes, Nien F. Zhang, Hui Zhou, Andras Vladar, John S. Villarrubia, Regis J. Kline, Daniel Sunday, Alok Vaid

There has been significant interest in hybrid metrology as a novel method for reducing overall measurement uncertainty and optimizing measurement throughput (speed) through rigorous combinations of two or more different measurement techniques into a single

Terahertz Active and Passive Imaging

April 11, 2014

Author(s)

Erich N. Grossman, Joshua A. Gordon, David R. Novotny, Richard A. Chamberlin

We describe the results of bistatic scattering measurements covering 325-650 GHz on a series of wellcharacterized random rough test surfaces. These have implications for active THz imagers that use coherent sources for illumination. The mean scattered

10 nm Three-Dimensional CD-SEM Metrology

April 10, 2014

Author(s)

Andras Vladar, John S. Villarrubia, Bin Ming, Regis J. Kline, Jasmeet Chawla, Scott List, Michael T. Postek

The shape and dimensions of a challenging pattern have been measured using a model-based library scanning electron microscope (MBL SEM) technique. The sample consisted of a 4-line repeating pattern. Lines were narrow (10 nm), asymmetric (different edge

Estimates of photoluminescence efficiencies in GaN nanowires at high injection levels from steady- state photoluminescence measurements

March 10, 2014

Author(s)

John B. Schlager, Matthew D. Brubaker, Kristine A. Bertness, Norman A. Sanford

Photoluminescence (PL) efficiencies were estimated for individual silicon-doped GaN nanowires grown by plasma assisted molecular beam epitaxy (PAMBE). Steady-state PL measurements reveal efficiencies that depend on excitation intensity, temperature, and

Metrology Needs for TSV Fabrication

March 4, 2014

Author(s)

Victor H. Vartanian, Richard A. Allen, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp

This paper focuses on the metrology needs and challenges of through silicon via (TSV) fabrication, consisting of TSV etch, liner, barrier, and seed (L/B/S) depositions, copper plating, and copper CMP. These TSVs, with typical dimensions within a factor of

Constant Shape Factor Frequency Modulated Charge Pumping (FMCP)

March 3, 2014

Author(s)

Jason T. Ryan, Jason P. Campbell, Jibin Zou, Kin P. Cheung, Richard Southwick, Anthony Oates, Rue Huang

Abstract We examine the seemingly frequency-dependent gate leakage current component of frequency-modulated charge pumping and show it to be a measurement artifact. If untreated, this results in erroneous defect density extractions. We present a constant

Detection of 3D Interconnect Bonding Voids by IR Microscopy

February 20, 2014

Author(s)

Jonny H?glund, Zoltan Kiss, Gyorgy Nadudvari , Zsolt Kovacs, Szabolcs Velkei, Moore Chris, Victor H. Vartanian, Richard A. Allen

There are a number of factors driving 3D integration including reduced power consumption, RC delay, and form factor as well as increased bandwidth. However, before these advantages can be realized, various technical and cost hurdles must be overcome. One

In situ temperature measurements for selective epitaxy of GaN nanowires

February 17, 2014

Author(s)

Kristine A. Bertness, Matthew D. Brubaker, Todd E. Harvey, Shannon M. Duff, Aric W. Sanders, Norman A. Sanford

We demonstrate with spatially resolved, in situ temperature measurements and ex situ reflectance measurements that differences in appearance for masked and unmasked surfaces on patterned growth substrates arise from wavelength-dependent emissivity