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Kristine A. Bertness, Matthew D. Brubaker, Todd E. Harvey, Shannon M. Duff, Aric W. Sanders, Norman A. Sanford
We demonstrate with spatially resolved, in situ temperature measurements and ex situ reflectance measurements that differences in appearance for masked and unmasked surfaces on patterned growth substrates arise from wavelength-dependent emissivity
Ryan C. Nieuwendaal, Chad R. Snyder, Dean M. DeLongchamp
We report on details of molecular packing in high molar mass poly(3-hexylthiophene) (P3HT) by solid-state 13C {1H} cross-polarization magic angle spinning (CPMAS) NMR measurements. The degree of polymer order was estimated for two films of varied drying
Christopher W. Petz, Dongyue Yang, Alline Myers, Jeremey Levy, Jerrold Floro
This work examines Si overgrowth to encapsulate 3C-SiC quantum dot arrays epitaxially grown on Si substrates. Using transmission electron microscopy we show how the crystalline quality of the Si cap depends on the growth conditions. Overgrowth at 300ºC
Brent A. Sperling, William A. Kimes, James E. Maslar
Infrared spectroscopy has been widely used for in situ analysis of the gas phase during chemical vapor deposition (CVD) and atomic layer deposition (ALD). For both process monitoring and research applications, accurate determination of absorptivity is
Albert A. Talin, Andrea Centrone, Alexandra C. Ford, Michael E. Foster, Vitalie Stavila, Paul M. Haney, Robert A. Kinney, Veronika Szalai, Farid El Gabaly, Heayoung Yoon, Francois Leonard, Mark Allendorf
We report a strategy for realizing tunable electrical conductivity in MOFs in which the nanopores are infiltrated with redox-active, conjugated guest molecules. This approach is demonstrated using thin-film devices of the MOF Cu3(BTC)2 (also known as HKUST
Chukwudi A. Okoro, June W. Lau, Yaw S. Obeng, Klaus Hummler
In this work, a detailed failure analysis of the physical root cause for the increase in electrical resistance and radio-frequency (RF) transmission coefficient of through-silicon via (TSV) daisy chain was investigated. Six different failure modes were
We utilize magnetic resonance measurements to identify the fundamental atomic-scale defect structures involved in the negative bias temperature instability. In gate stacks composed of pure silicon dioxide, we find a degradation mechanism directly involving
Lin You, Emily Hitz, Jungjoon Ahn, Yaw S. Obeng, Joseph J. Kopanski
As demands in the semiconductor industry call for further miniaturization and performance enhancement of electronic systems, the traditional planar (2D) electronic interconnection and packaging technologies show their difficulties in meeting the ever
Sergio Cova, Massimo Ghioni, Mark A. Itzler, Joshua Bienfang, Alessandro Restelli
There is nowadays a widespread and growing interest in low-level light detection and imaging. This interest is driven by the need for high sensitivity in various scientific and industrial applications such as fluorescence spectroscopy in life and material
Jungjoon Ahn, Min-Seok Kang, Lin You, Joseph J. Kopanski, Sang-Mo Koo
AlGaN/GaN Schottky barrier diodes (SBDs) have received much attention for high power and high- frequency applications because of the high breakdown field in the wide band gap semiconductor. Schottky contacts with tunable barrier height (ΦB) between the
Aveek Gangopadhyay, Saugandhika Minnikanti, Darwin Reyes-Hernandez, Mulpuri V. Rao, Nathalia Peixoto
A microfabricated device comprised of a microelectrode array (MEA) and a microfluidic channel is presented here for the purpose of trapping cells using positive dielectrophoresis (DEP). Transparent indium tin oxide (ITO) electrodes are patterned in an
Bryan M. Barnes, Martin Y. Sohn, Francois R. Goasmat, Hui Zhou, Andras Vladar, Richard M. Silver, Abraham Arceo
Identifying defects in photolithographic patterning is a persistent challenge in semiconductor manufacturing. Well-established optical methods in current use are jeopardized by upcoming sub-20 nm device dimensions. Volumetric processing of focus-resolved