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Notice of Funding Opportunity: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development
U.S. Department of Commerce Invites Eight Teams to Submit Applications for the National Advanced Packaging Manufacturing Program Funding Opportunity for Materials and Substrates
On May 22, 2024, the U.S. Department of Commerce announced that eight teams have been selected to submit full applications for the National Advanced Packaging Manufacturing Program (NAPMP) funding opportunity for materials and substrate materials. The funding opportunity, released in February 2024, requested applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. CHIPS R&D is a critical part of President Biden’s agenda to support American innovation for decades to come.
Emerging applications like artificial intelligence, advanced telecommunications, biomedical devices, and autonomous vehicles require leap-ahead advances in microelectronics capabilities. Substrates are the basis for advanced packaging, which will enhance all aspects of system performance. More capable substrates open the door to innovation at every other level in the packaging process.
Final projects will play a vital role in helping to ensure that American innovation drives cutting-edge developments in semiconductor R&D and manufacturing. The CHIPS for America program anticipates awarding approximately $300 million in amounts up to approximately $100 million over up to 5 years per award. Program awards may be leveraged by voluntary co-investment. Full applications were due on July 3, 2024.
Please visit the CHIPS R&D funding page for information on other opportunities.
On February 28, 2024, CHIPS for America issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the first NOFO released by the CHIPS for America R&D program office, and the third NOFO released overall by CHIPS for America.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Funding Opportunity
Read the full text of the funding opportunity (PDF) for more information.
FAQ: CHIPS R&D Research Security and Technology Protection (PDF)
FAQ: International Engagement in CHIPS R&D Programs (PDF)
Additional Frequently Asked Questions
CHIPS Technology Protection Guidebook (PDF)
CHIPS R&D Commercial Viability and Domestic Production (CVDP) Plan Guidebook (PDF)
NAPMP NOFO 1 Concept Paper Review Process Overview (PDF)
Read more on the vision for the CHIPS NAPMP.
CHIPS NAPMP Funding Opportunity Application Process:
Through this NOFO, the NAPMP program seeks to achieve the following objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
There are two main components to this application:
Mandatory Concept Paper: Applicants will be asked to submit a concept paper. Concept papers were due on April 12, 2024.
- Eligible applicants can only submit one concept plan paper under this NOFO.
- No entity may be included as a subrecipient on more than two concept papers.
- Concept plans received after the deadline will not be reviewed or considered.
Full Application Process: Full proposals were due July 3, 2024.
- Full applications will only be accepted from applicants who were invited to submit a full application after review of their mandatory concept paper.
Additional resources for the advanced packaging substrates and substrate materials funding opportunity:
Learn about additional CHIPS for America R&D funding opportunities.