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Displaying 51 - 75 of 106

Effects of Wafer Emissivity on Light-Pipe Rediometry in RTP Tools

September 1, 2001
Author(s)
Kenneth G. Kreider, David W. Allen, D H. Chen, D P. DeWitt, Christopher W. Meyer, Benjamin K. Tsai
We investigated the effect of different wafer emissivities and the effect of low emissivity films on rapid thermal processing (RTP) wafer temperature measurements using lightpipe radiation thermometers (LPRTs). These tests were performed in the NIST RTP

Bidirectional Reflectance Distribution Function of Rough Silicon Wafers

July 1, 2001
Author(s)
Y J. Shen, Z M. Zhang, Benjamin K. Tsai, D P. DeWitt
The trend towards miniaturization of patterning features in integrated circuits (IC) has made traditional batch furnaces inadequate for many processes. Rapid thermal processing (RTP) for silicon wafers has become more popular in recent years for IC

Noncontact Thermometry in the Optical Technology Division at NIST

March 1, 2001
Author(s)
Charles E. Gibson, Howard W. Yoon, Benjamin K. Tsai, Bettye C. Johnson, Robert D. Saunders
The Optical Technology Division (OTD) at the National Institute of Standards and Technology (NIST) maintains the thermodynamic temperature scale above the silver freezing point using spectral radiance ratios according to the International Temperature Scale

Workshop on Temperature Measurement of Semiconductor Wafers Using Thermocouples

January 1, 2001
Author(s)
Kenneth G. Kreider, D P. DeWitt, Benjamin K. Tsai, B Lojek
Temperature measurement is an important parameter in most semiconductor processes. These measurements are necessary in temperature ranges as low as below 0 C in some plasma etch processes, to near room temperature for soft bakes of resists, to 500 C for

Characterization of Lightpipe Radiation Thermometers for the NIST Test Bed

September 1, 2000
Author(s)
Benjamin K. Tsai, Christopher W. Meyer, Francis J. Lovas
For the past decade, lightpipe radiation theromoeters (LPRTs) have become the sensors of choice in rapid thermal processing (RTP) applications because of their non-intrusiveness and ease of use. In this paper, we discuss the importance of proper LPRT

Radiative Calibration of Heat Flux Sensors at NIST: Facilities and Techniques

March 1, 2000
Author(s)
A V. Murthy, Benjamin K. Tsai, Robert D. Saunders
An overview of the National Institute of Standards and Technology (NIST) high temperature blackbodies, both in operation and in development, suitable for heat flux sensor calibration is presented. Typical results of calibrations using the transfer

Comparative Calibration of Heat Flux Sensors in Two Blackbody Facilities

November 17, 1999
Author(s)
A V. Murthy, Benjamin K. Tsai, Robert D. Saunders
This paper presents the results of heat flux sensor calibrations in two blackbody facilities: the 25 mm variable temperature blackbody (VTBB) primary facility and a recently developed 51 mm aperture spherical blackbody (SPBB) facility. Three Schmidt