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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 151 - 175 of 333

Electrodeposition of Pt_(100-x)Pb_(x) Metastable Alloys and Intermetallics

April 4, 2011
Author(s)
Sun M. Hwang, John E. Bonevich, Jae Jeong Kim, Thomas P. Moffat
The electrodeposition of a series of metastable Pt-Pb alloys and intermetallic phases as well as elemental Pt is demonstrated using an acid electrolyte comprised of 0.05 mol/L Pb(ClO_4)_2 and/or 0.001 mol/L K_2PtCl_4. Pt-Pb films were deposited at various

Superconformal Ni Electrodeposition using 2-Mercaptobenzimidazole

April 4, 2011
Author(s)
Chang H. Lee, John E. Bonevich, Ugo Bertocci, Kristen L. Steffens, Thomas P. Moffat
Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni

Superconformal Electrodeposition for 3-D Interconnects

September 7, 2010
Author(s)
Thomas P. Moffat, Daniel Josell
Electrodeposition is a key fabrication process used in the state-of-the-art multilevel Cu metallization of microelectronic interconnects from transistor to circuit board length scale. Recent electrochemical surface science and feature filling studies have

Accelerator Surface Phase Associated with Superconformal Cu Electrodeposition

March 5, 2010
Author(s)
Thomas P. Moffat, Liang Yueh Ou Yang
Superconformal film growth is a key process in state-of-the-art Cu metallization of electronic devices. Superfilling of recessed surface features results from competition between electrolyte additives that accelerate or inhibit Cu electroplating. In situ

3-D Metallization by Damascene Electrodeposition

January 1, 2010
Author(s)
Thomas P. Moffat, Chang H. Lee, Daniel Josell
Electrodeposition is a key fabrication process used in the state-of-the-art multilevel Cu metallization of microelectronic interconnects from transistor to circuit board length scale. Recent electrochemical surface science and feature filling studies have

Electrochemical Micromachining of Hastelloy B-2 with Ultrashort Voltage Pulses

September 8, 2009
Author(s)
Gordon A. Shaw, Joseph J. Maurer, Steven E. Fick, Thomas P. Moffat, J. J. Mallett, John L. Hudson
Electrochemical micromachining (ECMM) with ultrashort voltage pulses, a maskless all-electrochemical micro and nanofabrication technique, has been used to fabricate microstructures on a corrosion resistant nickel-based superalloy, Hastelloy B-2. Because of

Three-Dimensionally Structured CdTe Thin Film Photovoltaic Devices with Self-Aligned Back Contacts: Electrodeposition on Interdigitated Electrodes.

June 25, 2009
Author(s)
Daniel Josell, Carlos R. Beauchamp, Suyong S. Jung, Behrang H. Hamadani, Abhishek Motayed, Lee J. Richter, Maureen E. Williams, John E. Bonevich, Alexander J. Shapiro, Nikolai B. Zhitenev, Thomas P. Moffat
Cadmium-telluride photovoltaic cells were deposited on substrates patterned with two interdigitated electrodes. Deposition involved application of different potentials to the two electrodes in order to obtain a 3-d gradient of film properties within the