Via Filling by Electrodeposition: Superconformal Silver and Copper and Conformal Nickel
Daniel Josell, B C. Baker, C Witt, Daniel Wheeler, Thomas P. Moffat
This paper presents the first demonstration of superconformal deposition of silver in vias. The observed experimental fill behavior is compared with predictions from a model that is based on the curvature enhanced accelerator coverage mechanism of superconformal deposition. Superconformal copper disposition and conformal nickel deposition results are also modeled. The previously published model predicts via filling behavior using the dependence of deposition rate kinetics on the coverage of adsorbed catalyst. The requisite kinetic parameters are obtained from independent current-voltage and current-time transient studies conducted on planar substrates.
, Baker, B.
, Witt, C.
, Wheeler, D.
and Moffat, T.
Via Filling by Electrodeposition: Superconformal Silver and Copper and Conformal Nickel, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853133
(Accessed December 6, 2023)