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Via Filling by Electrodeposition: Superconformal Silver and Copper and Conformal Nickel



Daniel Josell, B C. Baker, C Witt, Daniel Wheeler, Thomas P. Moffat


This paper presents the first demonstration of superconformal deposition of silver in vias. The observed experimental fill behavior is compared with predictions from a model that is based on the curvature enhanced accelerator coverage mechanism of superconformal deposition. Superconformal copper disposition and conformal nickel deposition results are also modeled. The previously published model predicts via filling behavior using the dependence of deposition rate kinetics on the coverage of adsorbed catalyst. The requisite kinetic parameters are obtained from independent current-voltage and current-time transient studies conducted on planar substrates.
Journal of the Electrochemical Society
No. 12


Conformal Nickel, Superconformal copper, Superconformal Silver


Josell, D. , Baker, B. , Witt, C. , Wheeler, D. and Moffat, T. (2002), Via Filling by Electrodeposition: Superconformal Silver and Copper and Conformal Nickel, Journal of the Electrochemical Society, [online], (Accessed May 26, 2024)


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Created October 23, 2002, Updated October 12, 2021