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Superconformal Electrodeposition of Silver in Submicrometer Features



Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell


The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide electrolyte. The CEAC mechanism involves: (1) a local metal deposition rate that increases with coverage of a catalytic species adsorbed on the metal/electrolyte interface and (2) significant change of local coverage of catalyst (and thus local deposition rate) in submicrometer features through changing area of the metal/electrolyte interface. In accord with the model, the electrolyte yields bright compact films, hysteretic i-V curves and rising chronoamperometric transients. Electrochemical and X-ray photoelectron experiments with planar electrodes were used to identify the catalyst and obtain all kinetic parameters required for the simulations of trench filling. Experiments and simulations of silver deposition in 350-200 nm wide trenches are presented. The results support the CEAC mechanism as a quantitative formalism for exploring morphological evolution during film growth.
Journal of the Electrochemical Society
No. 8


Electrodeposition, Silver, Superconformal, Superfill, Trenches


Moffat, T. , Baker, B. , Wheeler, D. , Bonevich, J. , Edelstein, M. , , D. , Gan, L. , Stafford, G. , Chen, P. , Egelhoff, W. and Josell, D. (2002), Superconformal Electrodeposition of Silver in Submicrometer Features, Journal of the Electrochemical Society, [online], (Accessed July 23, 2024)


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Created August 1, 2002, Updated February 17, 2017