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Correlation Between Structural Imperfection and Giant Magnetoresistance in Electrodeposited Co/Cu Multilayers

Published

Author(s)

M Shima, L Salamanca-Riba, Robert D. McMichael, Thomas P. Moffat

Abstract

The effect of structural imperfection on the giant magnetoresistance (GMR) of electrodeposited Co/Cu multilayer films was examined. The Co/Cu multilayers were grown on(100) textured Cu seed layers on Si(100). Transmission electron microscopy reveals that the epitaxial growth of the Co/Cu multilaters results in columnar grains with an average width of 40-60 nm. The multilayer structure is significantly perturbed by grain boundary grooving. The perturbation gives rise to strong magnetostatic coupling between neighboring magnetic layers which overwhelms the desired antiferromagnetic exchange coupling required for large GMR.
Citation
Journal of the Electrochemical Society
Volume
148
Issue
No. 8

Keywords

Copper/Cobalt, Electrodeposition, GMR, Multilayer

Citation

Shima, M. , Salamanca-Riba, L. , McMichael, R. and Moffat, T. (2001), Correlation Between Structural Imperfection and Giant Magnetoresistance in Electrodeposited Co/Cu Multilayers, Journal of the Electrochemical Society (Accessed April 16, 2024)
Created August 1, 2001, Updated February 17, 2017