A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

Published

November 2, 2001

Author(s)

Daniel Josell, Daniel Wheeler, W H. Huber, John E. Bonevich, Thomas P. Moffat

Abstract

We present a single variable first-order differential equation for predicting the occurrence of superconformal electrodeposition. The equation presumes that the dependence of deposition rate on surface coverage of accelerator is known (e.g., derived from voltammetry experiments) on planar electrodes. A simplified growth geometry, based on the recently proposed mechanism of curvature enhanced accelerator coverage, is used to permit simplification of the trench-filling problem. The resulting solution is shown to reduce computational time from hours to seconds, while yielding reasonably accurate predictions of the parameter values required for trench filling.

Citation

Journal of the Electrochemical Society

Volume

148

Issue

No. 12

Pub Type

Journals

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Keywords

copper, damascene, electrodeposition, superconformal, superfill

Citation

Josell, D. , Wheeler, D. , Huber, W. , Bonevich, J. and Moffat, T. (2001), A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853067 (Accessed October 3, 2025)