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A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches



Daniel Josell, Daniel Wheeler, W H. Huber, John E. Bonevich, Thomas P. Moffat


We present a single variable first-order differential equation for predicting the occurrence of superconformal electrodeposition. The equation presumes that the dependence of deposition rate on surface coverage of accelerator is known (e.g., derived from voltammetry experiments) on planar electrodes. A simplified growth geometry, based on the recently proposed mechanism of curvature enhanced accelerator coverage, is used to permit simplification of the trench-filling problem. The resulting solution is shown to reduce computational time from hours to seconds, while yielding reasonably accurate predictions of the parameter values required for trench filling.
Journal of the Electrochemical Society
No. 12


copper, damascene, electrodeposition, superconformal, superfill


Josell, D. , Wheeler, D. , Huber, W. , Bonevich, J. and Moffat, T. (2001), A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches, Journal of the Electrochemical Society, [online], (Accessed May 29, 2024)


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Created November 1, 2001, Updated October 12, 2021