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Superconformal Electrodeposition in Submicron Features

Published

Author(s)

Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat

Abstract

Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local coverage in fine features changes more due to interfacearea change than by accumulation from the electrolyte, yielding superconformal growth. The model is supported by experiments and simulations of copper deposition in 350-100 nm wide features, helping to explain the influence of adsorbates on roughness evolution.
Citation
Physical Review Letters
Volume
87
Issue
No. 1

Keywords

copper, electrodeposition, superconformal, superfill

Citation

Josell, D. , Wheeler, D. , Huber, W. and Moffat, T. (2001), Superconformal Electrodeposition in Submicron Features, Physical Review Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853028 (Accessed January 29, 2022)
Created June 30, 2001, Updated October 12, 2021