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Displaying 426 - 450 of 1400

Interference and Coexistence of Wireless Systems in Critical Infrastructure

July 7, 2015
Author(s)
Galen H. Koepke, William F. Young, John M. Ladbury, Jason B. Coder
We examine interference and coexistence testing issues, test methods, and the need to update and develop new test methodologies related to the use of wireless devices in critical infrastructure systems. A case study on interference is presented along with

Designing a Cyber-Physical Cloud Computing Architecture

June 2, 2015
Author(s)
Eric D. Simmon, Sulayman Sowe, Koji Zettsu
In this era of inter-connectivity where almost everybody, everything, and anything are networked, Cyber-Physical Systems (CPS) also known as the Internet of Things (IoT) have emerged as vital systems that use information systems to observe and modify the

Evaluation of Uncertainty in Temporal Waveforms of Microwave Transistors

June 1, 2015
Author(s)
Gustavo Avolio, Antonio Raffo, Jeffrey Jargon, Dominique Schreurs, Dylan Williams
This work focuses on the accuracy of nonlinear de-embedding applied to microwave transistor time-domain waveforms. The waveforms are acquired with a mixer-based Large-Signal Network Analyzer (LSNA) and are corrected at the transistor's reference planes by

PASSING THE BATON: Message FROM THE INCOMING EDITOR-IN-CHIEF

June 1, 2015
Author(s)
Hamid Gharavi
This incoming Editor In Chief's (EIC) message is expected to appear in the next issue of the IEEE wireless communications. The editorial team will be under the leadership of the new EIC for a period of three years.

Experimentally, How Does Cu TSV Diameter Influence its Stress State?

May 27, 2015
Author(s)
Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Ruqing Xu
In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which

Rectangular-Waveguide Impedance

May 22, 2015
Author(s)
Dylan F. Williams, Jeffrey A. Jargon, Uwe Arz, Paul D. Hale
We discuss the role of the wave impedance in temporal measurements in rectangular waveguide and present a simple rule-of-thumb for estimating the difference of the temporal electric and magnetic field waveforms supported by the dominant TE10 mode. We also

Electro-thermal Simulation of 1200 V 4H-SiC MOSFET Short-Circuit SOA

May 10, 2015
Author(s)
Tam H. Duong, Jose M. Ortiz, David W. Berning, Allen R. Hefner Jr., Sei-Hyung Ryu, John W. Palmour
The purpose of this paper is to introduce a dynamic electro-thermal simulation and analysis approach for device design and short-circuit safe-operating-area (SOA) characterization using a physics-based electro-thermal Saber®* model. Model parameter

Compact Nano-Mechanical Plasmonic Phase Modulators

April 1, 2015
Author(s)
Brian S. Dennis, Michael Haftel, David Czaplewski, Daniel Lopez, Girsh Blumberg, Vladimir Aksyuk
The miniaturization of photonic devices is fundamentally limited by the index of refraction of the constituent materials if light is confined in dielectric nanostructures. By coupling electromagnetic fields to metal's free electrons plasmonic devices
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