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Modeling MEMS Microhotplate Structures With SystemC

Published

Author(s)

Ankush Varma, Muhammad Afridi, Akin Akturk, Paul Klein, Allen R. Hefner Jr., Bruce Jacob

Abstract

Designers of SoCs with non-digital components, such as analog or MEMS devices, can currently use highlevel system design languages, such as SystemC, to model only the digital parts of a system. This is a significant limitation, since it makes key system design tasks ? design space exploration, hardware-software codesign and system verification ? more difficult. This paper describes lumped analytical models of a class of complex non-digital devices ? MEMS microhotplates ? and presents techniques used to integrate them into a SystemC simulation of a heterogeneous System-on-a-Chip (SoC). This approach makes MEMS component behavior visible to a full-system simulation at higher levels, allowing for realistic system design and testing. The contributions made in this work include the first SystemC models of a MEMS-based SoC, the first modeling of MEMS thermal behavior in SystemC, and a detailed case study of the application of these techniques to a real system. In addition, this work also provides insights into how MEMS device-level design decisions can significantly impact system-level behavior, and describes how full-system modeling can help in detecting such phenomena and addressing them early in the design flow.
Proceedings Title
INTERNATIONAL CONFERENCE ON COMPILERS, ARCHITECTURE, AND SYNTHESIS FOR EMBEDDED SYSTEMS
Conference Dates
October 23-25, 2006
Conference Location
Seoul, 1, KS

Keywords

MEMS, Microhotplate, modeling, sensor, SystemC

Citation

Varma, A. , Afridi, M. , Akturk, A. , Klein, P. , Hefner Jr., A. and Jacob, B. (2006), Modeling MEMS Microhotplate Structures With SystemC, INTERNATIONAL CONFERENCE ON COMPILERS, ARCHITECTURE, AND SYNTHESIS FOR EMBEDDED SYSTEMS, Seoul, 1, KS, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=32318 (Accessed April 17, 2024)
Created October 24, 2006, Updated October 12, 2021