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Nanoscale Reliability Group

The Nanoscale Reliability Group develops and disseminates science, standards, and technology for high-resolution measurements of material structure, chemistry, and physical properties, to ensure reliability of materials and devices with critical dimensions in the micrometer to nanometer regime.

The Nanoscale Reliability Group is part of the Applied Chemicals and Materials Division (ACMD) on the NIST Boulder campus. The group develops innovative metrologies and standards in the realms of electron, ion, optical, X-ray and scanned probe microscopies, to identify and locate atomic, nanoscale and microscale defects, and to determine physical responses of materials. Innovations include novel instruments, unique operating modes, and new analysis methods. The metrologies are deployed in key application areas including semiconductor and advanced manufacturing materials. The group seeks close interaction with external stake holders to ensure technology adoption and maximize impact of our applied programs.

News and Updates

GROUP PATENTS

NIST encourages patent protection on inventions when a patent would further the interests of U.S. manufacturing, increase the potential for current or future commercialization or use of the technology, would likely to lead to a license, would have a positive impact on a new field of science or technology and/or the visibility and vitality of NIST, or would further the goals of collaborative agreements.

Although patents are issued in the name of the inventor, the rights to inventions resulting from government work belong to the government. NIST's Technology Partnerships Office negotiates licensing of patented NIST technology.

Patents:

Sample holder, detector mask, and scope system for analytical transmission scanning electron microscopy
9,970,859; 9,746,415

Imaging spectrometer for extreme ultraviolet atom probe tomography
10,153,144; 9,899,197

Electron vibrometer for atomic force microscopy
10,060,946

Provisional/Pending Patents:

Dynamic multi-wavelength and sample voltage atom probe tomograph feedback control system
63/563,030

Additive manufacturing polyelectrolyte resin and additively manufacturing
18/206,667

Making a hydrogel from a sacrificial ionic scaffold
19/058,167

Projects and Programs

Electronic Material Characterization

Ongoing
Manufacturing optimized devices that incorporate newly-emerging materials requires predictable performance throughout device lifetimes. Unexpected degradation in device performance, sometimes leading to failure, is often traceable to poor material reliability. Reliability is rooted in the stability

Evaluation of 2D and WBG Material Quality Toward Device Reliability

Ongoing
Two-dimensional (2D) and wide band gap (WBG) materials are some of the latest materials classes having the potential to be transformative because of their high carrier mobilities, tunable bandgap, and atomic-scale film thicknesses. Unexpected degradation and failure in device performance is often

Extreme Atom Probe Tomography

Ongoing
Sub-nanometer-resolved 3-D chemical mapping of any atom in any solid continues to be an imperative goal of materials research. If reduced to practice, it would have profound scientific, engineering, and economic impacts on U.S. industries collectively worth hundreds of billions of dollars. Such

Photopolymer Additive Manufacturing

Ongoing
NEWS September 2021: NIST and Radtech have launched a Photopolymer Additive Manufacturing Alliance (PAMA) to advance strategic goals for research, sustainability, and regulation in PAM. PAMA is on a mission to make photopolymer additive manufacturing (PAM) more accessible and to increase the safe

Scanning Probe Microscopy for Advanced Materials and Processes

Ongoing
With a nanometer-sharp probe capable of delicate interaction with a limitless array of materials, SPM methods such as Atomic Force Microscopy (AFM) can aid in characterizing a wide range of materials in diverse environments from vacuum to biological serums. The atomic force microscope is operated in

Publications

Multistage Networks for Glassy Holographic Photopolymers

Author(s)
Alexander Osterbaan, Andrew Sias, Marianela Trujillo-Lemon, Kieran Fung, Jason Killgore, ROBERT MCLEOD, Christopher Bowman
In the writing of holographic photopolymers, the addition of a third stage cure to the typical polyurethane matrix and acrylate writing monomer steps is used

Awards

Press Coverage

Group Staff

Name
Phone
Email
Primary Project(s)
Benjamin Caplins(303) 497-6703benjamin.caplins [at] nist.gov (benjamin[dot]caplins[at]nist[dot]gov)Extreme Atom Probe Tomography
Ann Chiaramonti Debay(303) 497-5701chiaramonti [at] nist.gov (chiaramonti[at]nist[dot]gov)Extreme Atom Probe Tomography
Russell (Colby) Evans(303) 497-6226russell.evans [at] nist.gov (russell[dot]evans[at]nist[dot]gov)

Analytical Transmission Scanning Electron Microscopy

Electronic Material Characterization

Callie Higgins(303) 497-5991callie.higgins [at] nist.gov (callie[dot]higgins[at]nist[dot]gov)Photopolymer Additive Manufacturing
Jason Holm(303) 497-4335jason.holm [at] nist.gov (jason[dot]holm[at]nist[dot]gov)

Analytical Transmission Scanning Electron Microscopy

Electronic Material Characterization

Orion Kafka(303) 497-6597orion.kafka [at] nist.gov (orion[dot]kafka[at]nist[dot]gov)

X-Ray Computed Microtomography 

Photopolymer Additive Manufacturing

Jason Killgore(303) 497-4729jason.killgore [at] nist.gov (jason[dot]killgore[at]nist[dot]gov)

Scanned Probe Microscopy for Advanced Materials & Processes

Photopolymer Additive Manufacturing

Thomas Kolibaba(303) 497-5811thomas.kolibaba [at] nist.gov (thomas[dot]kolibaba[at]nist[dot]gov)

Electronic Material Characterization

Photopolymer Additive Manufacturing

Elisabeth Mansfield(303) 497-6405elisabeth.mansfield [at] nist.gov (elisabeth[dot]mansfield[at]nist[dot]gov)Electronic Material Characterization
Rion Wendland(303) 497-5991rion.wendland [at] nist.gov (rion[dot]wendland[at]nist[dot]gov)Photopolymer Additive Manufacturing
Ryan White(303) 497-3938ryan.white [at] nist.gov (ryan[dot]white[at]nist[dot]gov)Precision Imaging Facility

 

Contacts

Group Leader

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