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Material Measurement Laboratory / Applied Chemicals and Materials Division

Nanoscale Reliability Group

Projects/Programs

Displaying 1 - 9 of 9
2D Material Electronic Test

Electronic Material Characterization

Ongoing
Manufacturing optimized devices that incorporate newly-emerging materials requires predictable performance throughout device lifetimes. Unexpected degradation in device performance, sometimes leading to failure, is often traceable to poor material reliability. Reliability is rooted in the stability
A time series of a MoS2 flake exposed to increasing time under electrical stress shows the growth of defects denoted with red and yellow areas over time. S= source and D = drain electrode.

Evaluation of 2D and WBG Material Quality Toward Device Reliability

Ongoing
Two-dimensional (2D) and wide band gap (WBG) materials are some of the latest materials classes having the potential to be transformative because of their high carrier mobilities, tunable bandgap, and atomic-scale film thicknesses. Unexpected degradation and failure in device performance is often
extreme atom probe tomography illustration

Extreme Atom Probe Tomography

Ongoing
Sub-nanometer-resolved 3-D chemical mapping of any atom in any solid continues to be an imperative goal of materials research. If reduced to practice, it would have profound scientific, engineering, and economic impacts on U.S. industries collectively worth hundreds of billions of dollars. Such
Carbon Nanotubes imaged via Focused Ion Beam Scanning Electron Microscope.

Nanotube Quality Control

Completed
Thermogravimetric analysis (TGA) is widely used to gather data on nanotube chemistry. By monitoring weight loss as a function of temperature, one can determine decomposition kinetics and use this data to closely approximate the distribution of impurities present in a few milligrams of material
An image showing the hybrid AFM + SLA system from the SPM4AMP project

Photopolymer Additive Manufacturing

Ongoing
NEWS September 2021: NIST and Radtech have launched a Photopolymer Additive Manufacturing Alliance (PAMA) to advance strategic goals for research, sustainability, and regulation in PAM. PAMA is on a mission to make photopolymer additive manufacturing (PAM) more accessible and to increase the safe
CNT_interconnect_failure

Reliability Metrologies for Advanced Electronic Interconnects

Completed
High-performance devices, such as microprocessors and memory chips, are typically composed of structures with strict dimensional tolerances and geometries and are made up of various materials, all in close proximity in a three-dimensional system. Material interactions lead to reliability issues such
The SPMforAMP project develops novel SPM methods

Scanning Probe Microscopy for Advanced Materials and Processes

Ongoing
With a nanometer-sharp probe capable of delicate interaction with a limitless array of materials, SPM methods such as Atomic Force Microscopy (AFM) can aid in characterizing a wide range of materials in diverse environments from vacuum to biological serums. The atomic force microscope is operated in