The Nanoscale Reliability Group develops and disseminates science, standards, and technology for high-resolution measurements of material structure, chemistry, and physical properties, to ensure reliability of materials and devices with critical dimensions in the micrometer to nanometer regime.
The performance of advanced, reliable engineering materials requires that the proper atoms are in the correct place within the material, and that they are displaying the properties we intend. Innovative metrologies are developed and demonstrated in the realms of electron, ion, and scanned probe microscopies, to identify and locate atomic species, and to determine physical responses of materials. Test structures, measurement methods, and in situ and in operando approaches are developed to measure performance of complex material systems and geometries with high spatial resolution, enabling new reliability physics to be applied to nanoscale structures for computing, electronics, structural material, and energy applications. We integrate material structure metrologies with material performance and reliability assessments.
NIST encourages patent protection on inventions when a patent would further the interests of U.S. manufacturing, increase the potential for current or future commercialization or use of the technology, would likely to lead to a license, would have a positive impact on a new field of science or technology and/or the visibility and vitality of NIST, or would further the goals of collaborative agreements.
Although patents are issued in the name of the inventor, the rights to inventions resulting from government work belong to the government. NIST's Technology Partnerships Office negotiates licensing of patented NIST technology.
Electron vibrometer for atomic force microscopy
Researchers from the Nanoscale Reliability Group partnered with RadTech to develop and host the inaugural Photopolymer Additive Manufacturing Workshop: Roadmapping a Future for Stereolithography, Inkjet, and Beyond in October 2019.
|Benjamin Caplins||(303) email@example.com||Extreme Atom Probe Tomography|
|Ann Chiaramonti Debay||(303) firstname.lastname@example.org||Extreme Atom Probe Tomography|
|Callie Higgins||(303) email@example.com||Scanned Probe Microscopy for Advanced Materials & Processes|
|Jason Holm||(303) firstname.lastname@example.org||Analytical Transmission Scanning Electron Microscopy|
|Bob Keller||(303) email@example.com|
|Jason Killgore||(303) firstname.lastname@example.org||Scanned Probe Microscopy for Advanced Materials & Processes|
|Elisabeth Mansfield||(303) email@example.com||Electronic Material Characterization|
|Larry Robins||(303) firstname.lastname@example.org||Scanned Probe Microscopy for Advanced Materials & Processes|
|Ryan White||(303) email@example.com|