Nanoscale Reliability Group
The performance of advanced, reliable engineering materials requires that the proper atoms are in the correct place within the material, and that they are displaying the properties we intend. Innovative metrologies are developed in the realms of electron, ion, and scanned probe microscopies, to identify and locate atomic species, and to determine physical responses of materials. Test structures, measurement methods, and in operando approaches are developed to measure performance of complex material systems and geometries with high spatial resolution, enabling new reliability physics to be applied to nanoscale structures for computing, structural material, and energy applications. We integrate our material structure metrologies with material performance and reliability assessments.
NIST encourages patent protection on inventions when a patent would further the interests of U.S. manufacturing, increase the potential for current or future commercialization or use of the technology, would likely to lead to a license, would have a positive impact on a new field of science or technology and/or the visibility and vitality of NIST, or would further the goals of collaborative agreements.
Although patents are issued in the name of the inventor, the rights to inventions resulting from government work belong to the government. NIST's Technology Partnerships Office negotiates licensing of patented NIST technology.
Electron vibrometer for atomic force microscopy
Recent Group Highlights
Researchers from the Nanoscale Reliability Group have developed a new atomic force microscopy (AFM) method to measure the development of physical properties during their formation during 3-D printing. Sample-coupled-resonance photorheology (SCRPR) spatially resolves the evolution of properties over time scales of approximately 10 millisecond. For details, see New NIST Method Measures 3D Polymer Processing Precisely.
News and Updates
Projects and Programs
|Tobin Brown||(303) email@example.com||Scanned Probe Microscopy for Advanced Materials & Processes|
|Benjamin Caplins||(303) firstname.lastname@example.org||Extreme Atom Probe Tomography|
|Ann Chiaramonti Debay||(303) email@example.com||Extreme Atom Probe Tomography|
|Callie Higgins||(303) firstname.lastname@example.org||Scanned Probe Microscopy for Advanced Materials & Processes|
|Jason Holm||(303) email@example.com||Analytical Transmission Scanning Electron Microscopy|
|Bob Keller||(303) firstname.lastname@example.org|
|Jason Killgore||(303) email@example.com||Scanned Probe Microscopy for Advanced Materials & Processes|
|Elisabeth Mansfield||(303) firstname.lastname@example.org||Analytical Transmission Scanning Electron Microscopy|
|Larry Robins||(303) email@example.com||Scanned Probe Microscopy for Advanced Materials & Processes|
|Ryan White||(303) firstname.lastname@example.org|