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The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
This PlasmaTherm 790 reactive ion etcher (RIE) is a parallel plate plasma etching system which uses fluorocarbon and oxygen gases to etch silicon nitride thin
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces
The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process
The Rigaku SmartLab X-ray diffraction system (XRD) is a fully automated, modular system for advanced x-ray diffraction measurements on a wide range of materials
The two Sandvik anneal furnaces, equipped with silicon carbide tubes, support anneal processing in the NanoFab. The anneal furnaces allow nitrogen, argon and
The Sandvik low pressure chemical vapor deposition (LPCVD) of silicon oxide furnace supports low temperature oxide (LTO) on substrates ranging from small chips
The two Sandvik low pressure chemical vapor deposition (LPCVD) silicon nitride furnaces support stoichiometric and low stress silicon nitride deposition on
The two Sandvik oxidation furnaces, equipped with silicon carbide tubes, support oxidation processing in the NanoFab. The oxidation furnaces support thermal wet
The Semitool PSC-101 spin rinse dryer uses deionized water to rinse and heated nitrogen to dry whole wafer substrates automatically after wet chemical processes
The Silanization Oven is available to users in the Soft Lithography Laboratory. This tool supports the mold adhesion and release processes using organosilanes
The SSEC model 3300ML single wafer spray acid cleaning system supports general SC1 and Piranha processes in the NanoFab cleanroom. This system mixes, heats and
The SSEC model 3300ML single wafer spray acid cleaning system supports high purity SC1 and Piranha processes in the NanoFab cleanroom. This system mixes, heats
The SSEC model 3300ML single wafer spray acid cleaning system supports RCA process in the NanoFab cleanroom. This system mixes, heats and delivers chemicals on
The Suss MicroTec SB6 Gen2 wafer bonder is a substrate bonder that’s equipped to handle a wide range of substrate bonding processes. The bonder accommodates
The Denton “Bench Top Turbo” thermal evaporator is a single source evaporator equipped with substrate rotation, a thickness monitor, and automatic deposition
The Tousimis Supercritical Autosamdri-815 Series B critical point dryer utilizes liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in order
Name(s) of Calibrations/SRMs/SRD/SRIs and any related programs: NIST Special Tests for Natural Gas Flow (18080S) Summary The Fluid Metrology Group (FMG)
Over 10 independent digital image correlation (DIC) measurement systems are available in the NIST Center for Automotive Lightweighting. The majority of these
A cruciform test machine is available in the NIST Center for Automotive Lightweighting. This machine deforms a cross-shaped specimen with four specimen end tabs
Two independent x-ray diffraction stress measurement systems are available in the NIST Center for Automotive Lightweighting. These systems are integrated with
A forming limit press is available in the NIST Center for Automotive Lightweighting. This machine has been designed based on a modified Marciniak punch
An intermediate strain rate test machine is available in the NIST Center for Automotive Lightweighting. The actuator for this test machine can move at speeds up
An octostrain (8 tensile arms) test machine is available in the NIST Center for Automotive Lightweighting. By increasing the number of arms from the four used