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NanoFab Tool: Sandvik Oxidation Furnaces

Sandvik Anneal Furnaces
Credit: NIST

Photo of the Sandvik anneal furnaces

The two Sandvik oxidation furnaces, equipped with silicon carbide tubes, support oxidation processing in the NanoFab. The oxidation furnaces support thermal wet (pyrogenic) and dry oxidations, and oxidation with Trans-LC on substrates ranging from small chips to wafer diameters up to 150 mm. All samples require SC1 and SC2 cleans prior to processing.

Specifications/Capabilities

  • Automatic recipe controller using Variable Parameter Table (VPT).
  • Maximum Temperature: 1200 °C  
  • Standard processes:
    • Thermal wet (pyrogenic) oxidation
    • Thermal dry oxidation
    • Thermal oxidation with Trans-LC
  • Wafer diameters: 75 mm (3 in), 100 mm (4 in), and 150 mm (6 in)
  • Small pieces supported: Yes

Typical Applications

  • Field isolation.
  • Masking layers.
  • Gate dielectric studies
  • Selective etch stop
  • Surface passivation
Created April 10, 2019, Updated February 7, 2020