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NanoFab Tool: Reynolds RCA Wet Bench

Photograph of the Reynolds RCA wet bench.

The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces. The bench contains temperature controlled processing baths and a quick dump rinser. In addition, the bench has a dedicated buffered oxide etch bath for patterning silicon oxide. All baths can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.


  • Tank 1: Buffered oxide etch (BOE) dip tank (5:1 BOE).
  • Tank 2: Reflux heated bath for RCA Standard
    Clean 1-SC1.
  • Tank 3: Hydrofluoric acid (HF) dip tank with lid (2 % HF).
  • Tank 4: Automatic quick dump rinse with lid.
  • Tank 5: Reflux heated bath for RCA Standard
    Clean 2-SC2.
  • Tank 6 and 8: Small volume dip tanks for 100 mm (4 in) wafer cassettes and samples.
  • Tank 7 and 9: Small volume quartz heated baths for 100 mm (4 in) wafers cassettes and samples.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6 in).
  • Small pieces supported: Yes.

Typical Applications

  • Pre-furnace clean.
  • Silicon oxide patterning.
Created June 20, 2014, Updated December 4, 2019