The Silanization Oven is available to users in the Soft Lithography Laboratory. This tool supports the mold adhesion and release processes using organosilanes. The fully automated silanization coating system protects users from exposure to chemicals. It also allows for a wide variety of substrates, processing of wafers up to 200 mm in diameter, and improves the coating process. The system, which replaces the current desiccation process, allows for batch processing with repeatable results and chemical solutions are delivered on demand.
Process temperature: 100°C
Select Organosilane deposition
Single and Batch wafer capabilities
Supported Sample Sizes
Wafer diameter supported: 75 mm (3 inch), 100 mm (4 inch), 150 mm (6 inch), 200 mm (8 inch)