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NanoFab Tool: Silanization Oven

Silanization Oven

Image of Silanization Oven

The Silanization Oven is available to users in the Soft Lithography Laboratory. This tool supports the mold adhesion and release processes using organosilanes. The fully automated silanization coating system protects users from exposure to chemicals. It also allows for a wide variety of substrates, processing of wafers up to 200 mm in diameter, and improves the coating process. The system, which replaces the current desiccation process, allows for batch processing with repeatable results and chemical solutions are delivered on demand.


  • Process temperature: 100°C
  • Select Organosilane deposition
  • Single and Batch wafer capabilities

Usage Information

Supported Sample Sizes

  • Wafer diameter supported: 75 mm (3 inch), 100 mm (4 inch), 150 mm (6 inch), 200 mm (8 inch)
  • Small pieces supported: Yes 

Recommended Substrates/Restricted Materials

  • No additional chemistries to be used in the tool

Typical Applications

  • Release agent treatment
  • Adhesion agent treatment
  • O2 plasma cleaning
Created March 22, 2017, Updated November 9, 2020