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Search Publications by: Richard M. Silver (Fed)

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Displaying 126 - 150 of 154

A Macro-Micro Motion System for a STM

June 13, 2002
Author(s)
Bradley N. Damazo, James D. Gilsinn, Richard M. Silver, Hui Zhou
As nano-lithography improves, more companies and research groups have the capability to create nano-scale structures. Scanning Tunneling Microscopes (STMs) are commonly used to create these structures and evaluate them afterward. One difficulty is that

Nanomanufacturing of Atom-Based Dimensional Standards - A Final Project Report of the NAMT

January 1, 2002
Author(s)
Robert Allen, J J. Pellegrino, D Monk, E C. Teague, Dennis A. Swyt, Joseph Fu, Richard M. Silver, Theodore V. Vorburger, Bradley N. Damazo, Robert Russell, Thomas E. Wheatley, Keith A. Stouffer, Manfred Osti, David Wilmering, Richard L. Rhorer, Ram D. Sriram
This report describes the accomplishments of the Nanomanufacturing of Atom-based Dimensional Standards Project, which operated as part of the National Advanced Manufacturing Testbed (NAMT) a program formally operating from fiscal year (FY) 1996 to FY 2000

Comparison of Edge Detection Methods Using a Prototype Overlay Calibration Artifact

August 1, 2001
Author(s)
Richard M. Silver, Jay S. Jun, Edward A. Kornegay, R Morton
Accurate overlay measurements rely on robust, repeatable, and accurate feature position determination. In our effort to develop traceable we have examined a number of and the parameters which affect those measurements. The samples used in this study are a

Overlay Metrology: Recent Advances and Future Solutions

January 1, 2001
Author(s)
Richard M. Silver, Jay S. Jun, S Fox, Edward A. Kornegay
As devices shrink and clock speeds continue to increase, process control and measurement of I critical dimension linewidths and the essential overlay of features from different photolithographic levels become increasingly important. Improved manufacturing

Optical Linewidth Models: Then and Now

June 1, 1999
Author(s)
Robert D. Larrabee, Richard M. Silver, M P. Davidson
In the late 1970's, Dr. Diana Nyyssonen demonstrated that NIST could optically calibrate photomask linewidth standards that were narrower than the classical resolution limit of a conventional bright-field microscope. She equated the known position of the

Two-Dimensional Calibration Artifact and Measurement Methodology

June 1, 1999
Author(s)
Richard M. Silver, Theodore D. Doiron, William B. Penzes, S Fox, Edward A. Kornegay, S Rathjen, M Takac, D Owen
In this paper, we describe our design and the manufacturing of a two-dimensional grid artifact of chrome on quartz on a 6 inch by 6 inch by .250 glass blank. The design has been agreed upon by a number of SEMI participants working on a two-dimensional

Optical Linewidth Models - Then and Now

March 1, 1999
Author(s)
Robert D. Larrabee, Richard M. Silver, M P. Davidson
In the late 1970's Dr. Diana Nyyssonen demonstrated that the National Institute of Standards and Technology (NIST) could optically calibrate photomask linewidth standards that were narrower than the classical resolution limit of a conventional bright-field

Developing a Method to Determine Linewidth Based on Counting the Atom-Spacings Across a Line

June 1, 1998
Author(s)
Richard M. Silver, Carsten P. Jensen, V W. Tsai, Joseph Fu, John S. Villarrubia, E C. Teague
We are developing the instrumentation and prototype samples at NIST to enable the counting of atom-spacings across linewidth features etched in silicon. This is an effort to allow the accurate counting of atom-spacings across a feature in a controlled

Technical Directions of the NIST Precision Engineering Division: 1997-2001

January 1, 1998
Author(s)
Dennis A. Swyt, Howard H. Harary, Michael T. Postek, Richard M. Silver, Theodore V. Vorburger
This report, based on U.S. industry roadmaps and related National Institute of Standards and Technology studies, is a product of the process of strategic planning for the NIST Precision Engineering Division (PED) and presents the major technological trends

The Study of Silicon Stepped Surfaces as Atomic Force Microscope Calibration Standards With a Calibrated AFM at NIST

January 1, 1998
Author(s)
V W. Tsai, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, R Koning, Richard M. Silver, E. C. Williams
Due to the limitations of modern manufacturing technology, there is no commercial height artifact at the sub-nanometer scale currently available. The single-atom steps on a cleaned silicon (111) surface with a height of 0.314 nm, derived from the lattice

A Method to Characterize Overlay Tool Misalignments and Distortions

July 1, 1997
Author(s)
Richard M. Silver, James E. Potzick, Fredric Scire, Christopher J. Evans, Michael L. McGlauflin, Edward A. Kornegay, Robert D. Larrabee
A new optical alignment artifact under development at NIST is described. This structure, referred to as a stepped microcone, is designed to assist users and manufacturers of overlay metrology tools in the reduction of tool-induced measurement errors. We

Benchmarking the Length Measurement Capabilities of the National Institute of Standards and Technology

January 1, 1997
Author(s)
Richard M. Silver, J Land, Jack A. Stone Jr., Ronald G. Dixson, Bryon S. Faust, James E. Potzick, Michael T. Postek, et al
A cross-section of measurements from the Precision Engineering Division within the National Institute of Standards and Technology is benchmarked against other leading National Measurement Institutes. We present a variety of length-related calibration

High Accuracy Overlay Measurements

May 1, 1996
Author(s)
Richard M. Silver, James E. Potzick, Fredric Scire, Robert D. Larrabee
The reduced critical dimensions of semiconductor devices place more stringent requirements on the precision and accuracy of overlay metrology tools used to monitor stepper feature placement. The use of mix and match stepper techniques and step and scan

Height Calibration of Atomic Force Microscopes Using Silicon Atomic Step Artifacts

January 1, 1996
Author(s)
V W. Tsai, Theodore V. Vorburger, P Sullivan, Ronald G. Dixson, Richard M. Silver, Edwin R. Williams, J Schneir
The decreasing feature dimensions required in the semiconductor manufacturing industry are placing ever increasing demands upon metrology instruments. Atomic force microscopes (AFMs), which can have 1 nm lateral resolution and sub-angstrom vertical

Optical Overlay Metrology at NIST

January 1, 1996
Author(s)
Richard M. Silver, Amy Singer, L Carroll, S Berg-cross, James E. Potzick
Many of the significant challenges in making accurate overlay registration measurements are discussed. An understanding of the causes of the errors affecting these measurements is a prerequisite to improving accuracy and also for the design of standard

Metrology with the Ultraviolet Scanning Transmission Microscope

May 1, 1995
Author(s)
Richard M. Silver, James E. Potzick, Y Hu
A novel design for an ultraviolet critical dimension measurement transmission microscope utilizing the Stewart platform as the rigid main structure has been implemented. This new design shows improved vibration characteristics and is able to accommodate

Overlay Measurements and Standards

May 1, 1995
Author(s)
Richard M. Silver, James E. Potzick, Robert D. Larrabee
The relative misalignment of features produced by different mask levels (i.e., overlay error) is projected to become an increasingly important problem to the semiconductor industry as the size of the critical features continues to decrease. In response to