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Comparison of Edge Detection Methods Using a Prototype Overlay Calibration Artifact

Published

Author(s)

Richard M. Silver, Jay S. Jun, Edward A. Kornegay, R Morton

Abstract

Accurate overlay measurements rely on robust, repeatable, and accurate feature position determination. In our effort to develop traceable we have examined a number of and the parameters which affect those measurements. The samples used in this study are a comprehensive set of prototype overlay wafer standards. The methods for determining the position of a feature generally rely on some determination of edges, and the resulting feature centerline can be significantly affected by the method of choice. We have compared cross-correlation, centroid, and edge-threshold methods as well as a new integrated least !squares method. This paper is focused on empirical results obtained through the measurement of relevant overlay targets and pitch specimens. The data presented in this paper was acquired using charge coupled device (CCD)-based arrays.
Proceedings Title
Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XV, Neal T. Sullivan, Editor
Volume
4344
Conference Dates
February 26, 2001
Conference Title
Late Breaking News

Keywords

cross-correlation, edge detection methods, feature centerline, integrated least squares method, overlay standards

Citation

Silver, R. , Jun, J. , Kornegay, E. and Morton, R. (2001), Comparison of Edge Detection Methods Using a Prototype Overlay Calibration Artifact, Proceedings of SPIE, Metrology, Inspection, and Process Control for Microlithography XV, Neal T. Sullivan, Editor (Accessed April 19, 2024)
Created August 1, 2001, Updated February 19, 2017