NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Daniel Josell (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 76 - 100 of 142

Surfaces, Interfaces, and Changing Shapes

October 16, 2008
Author(s)
Daniel Josell, F Spaepen
It is generally recognized that the capillary forces associated with internal and external interfaces affect both the shapes of liquid-vapor surfaces and wetting of a solid by a liquid. It is less commonly understood that the same phenomenology often

Dependence of Exchange Coupling Interaction on Micromagnetic Constants in Hard/Soft Magnetic Bilayer Systems

September 1, 2007
Author(s)
Antonio Zambano, Hiroyuki Oguchi, Ichiro Takeuchi, Y W. Choi, J.S. Jiang, J P. Liu, S E. Lofland, Daniel Josell, Leonid A. Bendersky
To elucidate the dependence of exchange coupling behavior of hard/soft magnetic bilayer systems on various micromagnetic constants, the coupling length and the nucleation field (H (superscript_N)) were systematically measured on five thin film libraries

Electrodeposition of Ni in Sub-Micrometer Trenches

July 2, 2007
Author(s)
S D. Kim, John E. Bonevich, Daniel Josell, Thomas P. Moffat
A survey of the effect of cationic, anionic and non-ionic surfactants on the rate and morphological evolution of nickel electrodeposition from a Watts-type bath is presented. Particular attention is given to the prospect for void free filling of sub

Superfilling When Adsorbed Accelerators Are Mobile

February 6, 2007
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism has

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

October 10, 2006
Author(s)
Soo K. Kim, Daniel Josell, Thomas P. Moffat
Electroanalytical measurements and feature filling experiments have been conducted to study the effect of dodecyltrimethylammonium chloride (DTAC), a quaternary ammonium cationic surfactant, on Cu deposition in the presence of various combinations of

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

January 11, 2006
Author(s)
Thomas P. Moffat, Daniel Wheeler, Soo K. Kim, Daniel Josell
The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

December 2, 2005
Author(s)
Thomas P. Moffat, Marlon L. Walker, P J. Chen, John E. Bonevich, William F. Egelhoff Jr., Lee J. Richter, Daniel Josell, C A. Witt, T Aaltonen, M Ritala, M Leskela
Superfilling of sub-micrometer trenches by direct copper electrodeposition onto PVD and ALD Ru barriers is demonstrated. The Cu nucleation and growth mode is found to be sensitive to the oxidation state of the Ru surface as well as the copper deposition

Gold Superfill in Sub-Micrometer Trenches: Experiment and Prediction

November 16, 2005
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Bottom-up deposition of gold in fine trenches, also called superfill, was recently demonstrated using a submonolayer coverage of preadsorbed, deposition-rate-accelerating lead followed by gold electrodeposition. The present study has used experiments on

Combinatorial Investigation of Structural Quality of Au/Ni Contacts on GaN

June 1, 2004
Author(s)
Albert Davydov, Leonid A. Bendersky, William J. Boettinger, Daniel Josell, Mark D. Vaudin, C S. Chang, Ichiro Takeuchi
A combinatorial library of Au/Ni metalizations on GaN were microstructurally characterized by x-ray diffraction (XRD), electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM). The array of single- and bi-layered metal elements

Superconformal Deposition and the CEAC Mechanism

February 27, 2004
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
The mechanism and modeling of superconformal film growth used in the electrochemical fabrication of 3-D Cu interconnects is briefly reviewed. The central role of electrolyte additives in controlling feature filling is fully described by the curvature

An Exact, Algebraic Solution for the Incubation Period of Superfill

January 1, 2004
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Recent publications have used the impact of area change coupled with conservation of adsorbed catalyst to quantify the superfill effect of bottom-up feature filling during electrodeposition and chemical vapor deposition. This work describes how that

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

August 4, 2003
Author(s)
Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on

Rapid Deformation of Thin Gold Layers in Polymer Matrices Studied by X-Ray Reflectivity

August 1, 2003
Author(s)
K Shin, H Wang, Sushil K. Satija, Charles C. Han, Daniel Josell, John E. Bonevich
We have used X-ray reflectivity to measure the morphological profiles of thin Au layers of three different average thicknesses sandwiched between two polystyrene layers with different molecular weights, Mw = 52.3k and Mw - 168.5k. The results showed that
Was this page helpful?