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PUBLICATIONS

Electrical Properties of Superfilled Sub-Micrometer Silver Metallizations

Published

Author(s)

Daniel Josell, C +. Burkhard, David R. Kelley, Yi-Wen Cheng, R R. Keller, John E. Bonevich, Y Li, B C. Baker, C A. Witt, Thomas P. Moffat
Citation
Journal of Applied Physics
Volume
96
Issue
1
Pub Type
Journals

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Keywords

resistivity, silver, surface scattering

Citation

Josell, D. , Burkhard, C. , Kelley, D. , Cheng, Y. , Keller, R. , Bonevich, J. , Li, Y. , Baker, B. , Witt, C. and Moffat, T. (2004), Electrical Properties of Superfilled Sub-Micrometer Silver Metallizations, Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853319 (Accessed October 3, 2024)

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If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created June 30, 2004, Updated October 12, 2021