Josell, D.
, Wheeler, D.
, Witt, C.
and Moffat, T.
(2003),
Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255
(Accessed October 12, 2025)
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Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers
Published
Author(s)
, , C Witt,
Abstract
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on patterned silicon oxide. The electrolyte used was previously shown to yield superconformal feature filling on copper seeded features.Citation
Electrochemical and Solid State Letters
Volume
6
Issue
10
Pub Type
Journals
Download Paper
Keywords
copper, electrodeposition, ruthenium, seedless, superfill
Citation
Issues
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Created August 3, 2003, Updated October 12, 2021