Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers
Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on patterned silicon oxide. The electrolyte used was previously shown to yield superconformal feature filling on copper seeded features.
, Wheeler, D.
, Witt, C.
and Moffat, T.
Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255
(Accessed December 8, 2023)