Josell, D.
, Wheeler, D.
, Witt, C.
and Moffat, T.
(2003),
Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255
(Accessed November 11, 2024)