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Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

Published

Author(s)

Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat

Abstract

Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on patterned silicon oxide. The electrolyte used was previously shown to yield superconformal feature filling on copper seeded features.
Citation
Electrochemical and Solid State Letters
Volume
6
Issue
10

Keywords

copper, electrodeposition, ruthenium, seedless, superfill

Citation

Josell, D. , Wheeler, D. , Witt, C. and Moffat, T. (2003), Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255 (Accessed June 16, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created August 3, 2003, Updated October 12, 2021