Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

Published

August 4, 2003

Author(s)

Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat

Abstract

Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on patterned silicon oxide. The electrolyte used was previously shown to yield superconformal feature filling on copper seeded features.

Citation

Electrochemical and Solid State Letters

Volume

6

Issue

10

Pub Type

Journals

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Local Download

Keywords

copper, electrodeposition, ruthenium, seedless, superfill

Citation

Josell, D. , Wheeler, D. , Witt, C. and Moffat, T. (2003), Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers, Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255 (Accessed April 19, 2024)