TY  - JOUR
AU  - Daniel Josell
AU  - Daniel Wheeler
AU  - C Witt
AU  - Thomas Moffat
C2  - Electrochemical and Solid State Letters
DA  - 2003-08-04 00:08:00
LA  - en
M1  - 6
PB  - Electrochemical and Solid State Letters
PY  - 2003
TI  - Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255
ER  -