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An Exact, Algebraic Solution for the Incubation Period of Superfill

Published

Author(s)

Daniel Josell, Thomas P. Moffat, Daniel Wheeler

Abstract

Recent publications have used the impact of area change coupled with conservation of adsorbed catalyst to quantify the superfill effect of bottom-up feature filling during electrodeposition and chemical vapor deposition. This work describes how that superfilling process can be quantified using fronts that grow from corners where surfaces impinge. The results obtained apply only when catalyst is preadsorbed on the surface, with no subsequent accumulation of consumption. They are therefore of limited use for general process modeling. However, because they are exact solution, they can be used to check the accuracy of models and computer codes concerned with the more general problems of feature filling.
Citation
Journal of the Electrochemical Society
Volume
151
Issue
No. 1

Keywords

incubation, superconformal, superfill

Citation

Josell, D. , Moffat, T. and Wheeler, D. (2004), An Exact, Algebraic Solution for the Incubation Period of Superfill, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853248 (Accessed June 10, 2023)
Created December 31, 2003, Updated October 12, 2021