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Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing.

Published

Author(s)

Daniel Josell, John E. Bonevich, Thomas P. Moffat
Citation
Electrochemical and Solid State Letters

Citation

Josell, D. , Bonevich, J. and Moffat, T. (2006), Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing., Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=901778 (Accessed December 4, 2023)
Created October 1, 2006, Updated February 19, 2017