Josell, D.
, Bonevich, J.
and Moffat, T.
(2006),
Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing., Electrochemical and Solid State Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=901778
(Accessed September 19, 2024)
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Iridium Barriers for Direct Copper Electrodeposition in Damascene Processing.
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Electrochemical and Solid State Letters
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Created October 1, 2006, Updated February 19, 2017