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A New Paradigm for Interconnect Geometry to Reduce Grain Boundary Resistance

Published

Author(s)

Daniel Josell

Abstract

A zig-zag line geometry is introduced for control of grain boundary density within fine wires for interconnect applications; the geometry is selected because the grain boundaries will be driven toward the narrowest locations to reduce the free energy of the system. The positive impact of the reduced grain boundary density on electrical transport is weighed against the negative impact of local constrictions and reduced line packing that arise for the nonuniform width zig-zag geometry. It is found that a wide range of technologically relevant interconnects of sub-100 nm size could benefit substantially from use of the zig-zag line geometry.
Citation
Physics Review Letters
Volume
100
Issue
12

Citation

Josell, D. (2006), A New Paradigm for Interconnect Geometry to Reduce Grain Boundary Resistance, Physics Review Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853440 (Accessed May 20, 2024)

Issues

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Created December 21, 2006, Updated February 17, 2017